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/* $NoKeywords:$ */
/**
* @file
*
* mfParallelTraining.h
*
* Header file for the parallel training feature
*
* @xrefitem bom "File Content Label" "Release Content"
* @e project: AGESA
* @e sub-project: (Mem)
* @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
*
**/
/*****************************************************************************
*
* Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
*
* AMD is granting you permission to use this software (the Materials)
* pursuant to the terms and conditions of your Software License Agreement
* with AMD. This header does *NOT* give you permission to use the Materials
* or any rights under AMD's intellectual property. Your use of any portion
* of these Materials shall constitute your acceptance of those terms and
* conditions. If you do not agree to the terms and conditions of the Software
* License Agreement, please do not use any portion of these Materials.
*
* CONFIDENTIALITY: The Materials and all other information, identified as
* confidential and provided to you by AMD shall be kept confidential in
* accordance with the terms and conditions of the Software License Agreement.
*
* LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
* PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
* WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
* MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
* OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
* IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
* (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
* INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
* GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
* RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
* THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
* EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
* THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
*
* AMD does not assume any responsibility for any errors which may appear in
* the Materials or any other related information provided to you by AMD, or
* result from use of the Materials or any related information.
*
* You agree that you will not reverse engineer or decompile the Materials.
*
* NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
* further information, software, technical information, know-how, or show-how
* available to you. Additionally, AMD retains the right to modify the
* Materials at any time, without notice, and is not obligated to provide such
* modified Materials to you.
*
* U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
* "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
* subject to the restrictions as set forth in FAR 52.227-14 and
* DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
* Government constitutes acknowledgement of AMD's proprietary rights in them.
*
* EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
* direct product thereof will be exported directly or indirectly, into any
* country prohibited by the United States Export Administration Act and the
* regulations thereunder, without the required authorization from the U.S.
* government nor will be used for any purpose prohibited by the same.
* ***************************************************************************
*
*/
#ifndef _MFPARALLELTRAINING_H_
#define _MFPARALLELTRAINING_H_
/*----------------------------------------------------------------------------
* Mixed (DEFINITIONS AND MACROS / TYPEDEFS, STRUCTURES, ENUMS)
*
*----------------------------------------------------------------------------
*/
/*-----------------------------------------------------------------------------
* DEFINITIONS AND MACROS
*
*-----------------------------------------------------------------------------
*/
/*----------------------------------------------------------------------------
* TYPEDEFS, STRUCTURES, ENUMS
*
*----------------------------------------------------------------------------
*/
typedef BOOLEAN (*REMOTE_NBBLOCK_CONSTRUCTOR) (
IN OUT MEM_NB_BLOCK *NBPtr,
IN DIE_STRUCT *MCTPtr,
IN MEM_FEAT_BLOCK_NB *FeatPtr
);
///< This structure defines the environment on the AP for parallel training
typedef struct _REMOTE_TRAINING_ENV {
IN OUT AMD_CONFIG_PARAMS StdHeader; ///< Config pointer of BSP
IN OUT AGESA_STATUS (*GetPlatformCfg[MAX_PLATFORM_TYPES]) (struct _MEM_DATA_STRUCT *MemData, UINT8 SocketID, CH_DEF_STRUCT *CurrentChannel); ///< look-up platform info
IN OUT BOOLEAN (*ErrorHandling)(struct _DIE_STRUCT *MCTPtr, UINT8 DCT, UINT16 ChipSelMask, AMD_CONFIG_PARAMS *StdHeader); ///< Error Handling
IN REMOTE_NBBLOCK_CONSTRUCTOR NBBlockCtor; ///< NB Block constructor
IN MEM_FEAT_BLOCK_NB *FeatPtr; ///< Feature block pointer
IN UINT8 *TableBasedAlterations; ///< Point to an array of data bytes describing desired modifications to register settings
IN PSO_TABLE *PlatformMemoryConfiguration; ///< Point to platform config table
IN UINT32 HoleBase; ///< Used for Memtyping
IN UINT32 UmaSize; ///< Used for Memtyping
IN UINT16 BottomIo; ///< Used for Memtyping
IN UINT32 SysLimit; ///< Used for Memtyping
IN UINT8 BspSocket; ///< Socket number of BSP
IN UINT8 BspCore; ///< Core number of BSP
IN DIE_STRUCT DieStruct; ///< Remote copy of Die Struct
} REMOTE_TRAINING_ENV;
///< This structure defines Die information
typedef struct _DIE_INFO {
IN OUT UINT8 Socket; ///< Socket number
IN OUT UINT8 Core; ///< Core number
IN OUT BOOLEAN Training; ///< Training Flag, 1 = Training has been started on this core
} DIE_INFO;
/*----------------------------------------------------------------------------
* FUNCTIONS PROTOTYPE
*
*----------------------------------------------------------------------------
*/
BOOLEAN
MemFParallelTraining (
IN OUT REMOTE_TRAINING_ENV *EnvPtr,
IN OUT AMD_CONFIG_PARAMS *StdHeader
);
#endif /* _MFPARALLELTRAINING_H_ */
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