diff options
Diffstat (limited to 'util/blobtool/ddr3_unregistered_spd_256.spec')
-rw-r--r-- | util/blobtool/ddr3_unregistered_spd_256.spec | 241 |
1 files changed, 0 insertions, 241 deletions
diff --git a/util/blobtool/ddr3_unregistered_spd_256.spec b/util/blobtool/ddr3_unregistered_spd_256.spec deleted file mode 100644 index d9cf51e857..0000000000 --- a/util/blobtool/ddr3_unregistered_spd_256.spec +++ /dev/null @@ -1,241 +0,0 @@ -# Applies to unbuffered DIMM types -# UDIMM, SO-DIMM, Micro-DIMM, Micro-UDIMM, -# 72b-SO-UDIMM, 16b-SO-UDIMM, 32b-SO-UDIMM - - -# 4_01_02_11R24.pdf -# -# JEDEC Standard No. 21-C -# Page 4.1.2.11 - 1 -# Annex K: Serial Presence Detect (SPD) for DDR3 SDRAM Modules -# DDR3 SPD -# Document Release 6 -# UDIMM Revision 1.3 -# RDIMM Revision 1.3 -# CDIMM Revision 1.3 -# LRDIMM Revision 1.2 - -{ - # Byte 0: Number of Bytes Used / Number of Bytes in SPD Device / - # CRC Coverage - "SPD_Bytes_Used" : 4, - "SPD_Bytes_Total" : 3, - "CRC_Coverage" : 1, - - # Byte 1: SPD Revision - "SPD_Revision" : 8, - - # Byte 2: Key Byte / DRAM Device Type - "DRAM_Device_Type" : 8, - - # Byte 3: Key Byte / Module Type - "Module_Type" : 4, - "Byte_3_reserved" : 4, - - # Byte 4: SDRAM Density and Banks - "SDRAM_Capacity" : 4, - "Bank_Address_Bits" : 3, - "Byte_4_reserved" : 1, - - # Byte 5: SDRAM Addressing - "Column_Address_Bits" : 3, - "Row_Address_Bits" : 3, - "Byte_5_reserved" : 2, - - # Byte 6: Module Nominal Voltage, VDD - "NOT_1.5_V_Operable" : 1, - "1.35_V_Operable" : 1, - "1.25_V_Operable" : 1, - "Byte_6_reserved" : 5, - - # Byte 7: Module Organization - "SDRAM_Device_Width" : 3, - "Number_of_Ranks" : 3, - "Byte_7_reserved" : 2, - - # Byte 8: Module Memory Bus Width - "Primary_Bus_Width" : 3, - "Bus_Width_Extension" : 3, - "Byte_8_reserved" : 2, - - # Byte 9: Fine Timebase (FTB) Dividend / Divisor - "Fine_Timebase_Divisor" : 4, - "Fine_Timebase_Dividend" : 4, - - # Bytes 10 / 11: Medium Timebase (MTB) Dividend / Divisor - "Medium_Timebase_Dividend" : 8, - "Medium_Timebase_Divisor" : 8, - - # Byte 12: SDRAM Minimum Cycle Time (t CK min) - "Minimum_SDRAM_Cycle_Time" : 8, - - # Byte 13: Reserved - "Byte_13_Reserved" : 8, - - # Bytes 14 / 15: CAS Latencies Supported - "CL_4_Supported" : 1, - "CL_5_Supported" : 1, - "CL_6_Supported" : 1, - "CL_7_Supported" : 1, - "CL_8_Supported" : 1, - "CL_9_Supported" : 1, - "CL_10_Supported" : 1, - "CL_11_Supported" : 1, - - "CL_12_Supported" : 1, - "CL_13_Supported" : 1, - "CL_14_Supported" : 1, - "CL_15_Supported" : 1, - "CL_16_Supported" : 1, - "CL_17_Supported" : 1, - "CL_18_Supported" : 1, - "Byte_15_Reserved" : 1, - - # Byte 16: Minimum CAS Latency Time (tAAmin) - "tAAmin" : 8, - - # Byte 17: Minimum Write Recovery Time (tWRmin) - "tWRmin" : 8, - - # Byte 18: Minimum RAS to CAS Delay Time (tRCDmin) - "tRCDmin" : 8, - - # Byte 19: Minimum Row Active to Row Active Delay Time (tRRDmin) - "tRRDmin" : 8, - - # Byte 20: Minimum Row Precharge Delay Time (tRPmin) - "tRPmin" : 8, - - # Bytes 21 - 23: Minimum Active to Precharge Delay Time (tRASmin) - # / Minimum Active to Active/Refresh Delay Time - # (tRCmin) - "tRASmin_Most_Significant Nibble" : 4, - "tRCmin_Most_Significant Nibble" : 4, - "tRASmin_LSB" : 8, - "tRCmin_LSB" : 8, - - # Bytes 24 - 25: Minimum Refresh Recovery Delay Time (tRFCmin) - "tRFCmin LSB" : 8, - "tRFCmin MSB" : 8, - - # Byte 26: Minimum Internal Write to Read Command Delay Time - "tWTRmin" : 8, - - # Byte 27: Minimum Internal Read to Precharge Command Delay Time - # (tRTPmin) - "tRTPmin" : 8, - - # Byte 28 - 29: Minimum Four Activate Window Delay Time - # (tFAWmin) - "tFAWmin Most Significant Nibble" : 4, - "Byte_28_Reserved" : 4, - "tFAWmin Most Significant Byte" : 8, - - # Byte 30: SDRAM Optional Features - "RQZ_Div_6_Supported" : 1, - "RQZ_Div_7_Supported" : 1, - "Byte_30_Reserved" : 5, - "DLL_Off_Mode_Supported" : 1, - - # Byte 31: SDRAM Thermal and Refresh - # Options - "Extended_Temp_range_supported" : 1, - "Extended_Temp_Refresh_1x_Refresh" : 1, - "Auto_Self_Refresh_Supported" : 1, - "On-Die_Thermal_Sensor" : 1, - "Byte_31_Reserved" : 3, - "Partial_Array_Self_Refresh_Supported" : 1, - - # Byte 32: Module Thermal Sensor - "Thermal_Sensor_Accuracy" : 7, - "Thermal_Sensor_incorporated" : 1, - - # Byte 33: SDRAM Device Type - "Signal_Loading" : 2, - "Byte_33_Reserved" : 2, - "Die_Count" : 3, - "SDRAM_Device_Type" : 1, - - # Byte 34: Fine Offset for SDRAM Minimum - # Cycle Time (tCKmin) - "tCKmin_Fine_Offset" : 8, - - #Byte 35: Fine Offset for Minimum CAS Latency Time (tAAmin) - "tAAmin_Fine_Offset" : 8, - - # Byte 36: Fine Offset for Minimum RAS to CAS Delay Time - # (tRCDmin) - "tRCDmin_Fine_Offset" : 8, - - #Byte 37: Fine Offset for Minimum Row Precharge Delay Time - # (tRPmin) - "tRPmin_Fine_Offset" : 8, - - # Byte 38: Fine Offset for Minimum Active to Active/Refresh - # Delay Time (tRCmin) - "tRCmin_Fine_Offset" : 8, - - # Bytes 39 / 40: Reserved - "Byte_39_Reserved" : 8, - "Byte_40_Reserved" : 8, - - # Byte 41: SDRAM Maximum Active Count (MAC) Value - "Maximum_Activate_Count" : 4, - "Maximum_Activate_Window" : 2, - "Byte_41_Reserved" : 2, - - # Bytes 42 - 59: Reserved - "Reserved_bytes_42_to_59_" [18] : 8, - -# Module-Specific Section: Bytes 60 - 116 for Unbuffered DIMMS - - # Byte 60 (Unbuffered): Raw Card Extension, Module Nominal Height - "Module_Nominal_Height" : 5, - "Raw_Card_Estension" : 3, - - # Byte 61 (Unbuffered): Module Maximum Thickness - "Module_Thickness_Front" : 4, - "Module_Thickness_Back" : 4, - - # Byte 62 (Unbuffered): Reference Raw Card Used - "Reference_Raw_Card" : 5, - "Reference_Raw_Card_Revision" : 2, - "Reference_Raw_Card_Extension" : 1, - - # Byte 63: Address Mapping from Edge Connector to DRAM - "Rank_1_Mapping_Mirrored" : 1, - "Byte_63_Reserved" : 7, - - # Bytes 64 -116 (Unbuffered): Reserved - "Module_Specific_Byte_Reserved_"[53] : 8, - - # Bytes 117 - 118: Module ID: Module Manufacturers JEDEC ID Code - "Module_Manufacturer_JEDEC_ID_Code" : 16, - - # Byte 119: Module ID: Module Manufacturing Location - "Module_Manufacturing_Location" : 8, - - # Bytes 120 - 121: Module ID: Module Manufacturing Date - "Module_Manufacturing_Date" : 16, - - # Bytes 122 - 125: Module ID: Module Serial Number - "Module_Serial_Number" : 32, - - # Bytes 126 - 127: Cyclical Redundancy Code - "Module_CRC" : 16, - - # Bytes 128 - 145: Module Part Number - "Module_Part_Number"[18] : 8, - - # Bytes 146 - 147: Module Revision Code - "Module_Revision_Code" : 16, - - # Bytes 148 - 149: DRAM Manufacturers JEDEC ID Code - "DRAM_Manufacturer_JEDEC_ID_Code" : 16, - - # Bytes 150 - 175: Manufacturers Specific Data - "Manufacturer_Specific_Data_byte_" [26] : 8, - - # Bytes 176 - 255: Open for customer use - "Customer_use_byte_" [80] : 8 -} |