diff options
| author | Stefan Reinauer <stepan@coresystems.de> | 2008-12-01 14:18:57 +0000 |
|---|---|---|
| committer | Uwe Hermann <uwe@hermann-uwe.de> | 2008-12-01 14:18:57 +0000 |
| commit | 7a51e50582b65bb6ac54e8923470807b5975c6e1 (patch) | |
| tree | 9dcf146604016608951ec22602c1782e5d467f9a /util/abuild/abuild.1 | |
| parent | b4eb4fb6b06878c25a43458ff11cd3939d97c60e (diff) | |
The Winbond Super I/O chips have another indirection of registers. The
hwmon has generic registers and banked registers, mostly temperature
handling, and SMI/GPIO stuff.
Not all LDNs are switched via register offset 0x07, make it a parameter.
Add support for dumping the hardware monitor of Winbond W83627THF/THG
parts with the -e option.
Signed-off-by: Stefan Reinauer <stepan@coresystems.de>
Acked-by: Uwe Hermann <uwe@hermann-uwe.de>
git-svn-id: svn://svn.coreboot.org/coreboot/trunk@3784 2b7e53f0-3cfb-0310-b3e9-8179ed1497e1
Diffstat (limited to 'util/abuild/abuild.1')
0 files changed, 0 insertions, 0 deletions