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author | Furquan Shaikh <furquan@google.com> | 2020-05-29 13:31:04 -0700 |
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committer | Patrick Georgi <pgeorgi@google.com> | 2020-06-06 09:30:12 +0000 |
commit | f3a642de6dddaf4d7b284fc7198f6e63cd8a8088 (patch) | |
tree | 9f7a068e68b20bb1e31b8e2e79eec5e521ab4d3d /src/vendorcode/intel | |
parent | 20ecf2268b13a4d2a8b4a8490139ee064d9d8f62 (diff) |
mb/google/dedede/var/waddledee: Use auto-generated Makefile.inc using gen_part_id.go
This change adds mem_list_variant.txt that contains the list of
memory parts used by waddledee and Makefile.inc generated by
gen_part_id.go using mem_list_variant.txt.
In the final change of the series, all dedede variants will be
switched from using the current SPDs to new auto-generated SPDs.
Differences in auto-generated SPD from current SPD are as follows:
Part: MT53E512M32D2NP-046 WT:E
Byte# Current New Explanation
4 0x15 0x16 This part has only 1 die. Hence,
density per die is 16Gb.
6 0x90 0x04 1 die in package and 2 channels per
die.
9 0x40 0x00 Unused by MRC.
19 0x0F 0xFF As per JEDEC spec, tckMax should be
100ns. So, value should be 0xFF as
per datasheet.
123 0x00 0xE5 Fine offset for taa. Expected value
is 0xE5 as per datasheet.
125 0xE1 0xE0 Fine offset for tckMin. As per
datasheet tckMin is 0.468ns. So, this
comes out to be 0xE0.
Additionally, manufacturer name bytes are set to 0.
Part: NT6AP256T32AV-J2
Byte# Current New Explanation
4 0x14 0x15 This part has only 1 die. Hence,
density per die is 8Gb.
6 0x90 0x04 1 die in package and 2 channels per
die.
Manufacturer name bytes are set to 0.
Change-Id: I7a68a29ca3632e22f3960c9fc44acf3ce4f87c9c
Signed-off-by: Furquan Shaikh <furquan@google.com>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/41878
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Karthik Ramasubramanian <kramasub@google.com>
Diffstat (limited to 'src/vendorcode/intel')
0 files changed, 0 insertions, 0 deletions