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authorChris Wang <chris.wang@amd.corp-partner.google.com>2023-04-26 19:48:05 +0800
committerMartin L Roth <gaumless@gmail.com>2023-04-27 14:40:38 +0000
commitf9270265360930a46387d617c18e55e67833edfb (patch)
tree60f9b4a81be8455e6ed8a67246cb884c9198b30e /src/soc/samsung/exynos5250/Makefile.inc
parent78790c872c8bae4d0fc2cc4614fa9619c69116cd (diff)
soc/amd/mendocino: update FSP parameters for eDP power sequence adjustment
Add UPD parameter for eDP power sequence adjustment. The edp_panel_t9_ms parameter is set for bloff to varybloff. BUG=b:271704149 BRANCH=Skyrim TEST=Build; Verify the UPD was pass to system integrated table. Signed-off-by: Chris Wang <chris.wang@amd.corp-partner.google.com> Change-Id: Id651c9cc4d6f4e27f6c78ca10ca12936d66ef43b Reviewed-on: https://review.coreboot.org/c/coreboot/+/74789 Reviewed-by: Matt DeVillier <matt.devillier@amd.corp-partner.google.com> Reviewed-by: Jason Glenesk <jason.glenesk@gmail.com> Reviewed-by: Martin Roth <martin.roth@amd.corp-partner.google.com> Reviewed-by: Eric Lai <eric_lai@quanta.corp-partner.google.com> Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
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