soc/intel/common/thermal: Refactor thermal block to improve reusability

This patch moves common thermal API between chipsets
with thermal device as PCI device and thermal device behind PMC
into common file (thermal_common.c).

Introduce CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_PCI_DEV to let SoC
Kconfig to select as applicable for underlying chipset.

+------------------------------------------------------+--------------+
|               Thermal Kconfig                        |    SoC       |
+------------------------------------------------------+--------------+
| CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_PCI_DEV        | SKL/KBL, CNL |
|                                                      | till ICL     |
+------------------------------------------------------+--------------+
| CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_BEHIND_PMC     | TGL onwards  |
|                                                      | ICL          |
+------------------------------------------------------+--------------+

Either of these two Kconfig internally selects
CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL to use common thermal APIs.

BUG=b:193774296
TEST=Able to build and boot hatch and adlrvp platform.

Change-Id: I14df5145629ef03f358b98e824bca6a5b8ebdfc6
Signed-off-by: Subrata Banik <subrata.banik@intel.com>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/59509
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Angel Pons <th3fanbus@gmail.com>
Reviewed-by: EricR Lai <ericr_lai@compal.corp-partner.google.com>
Reviewed-by: Tim Wawrzynczak <twawrzynczak@chromium.org>

0 files changed, 0 insertions, 0 deletions