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author | Subrata Banik <subrata.banik@intel.com> | 2021-11-21 01:38:13 +0530 |
---|---|---|
committer | Subrata Banik <subrata.banik@intel.com> | 2021-11-25 07:18:04 +0000 |
commit | 281e2c1987f6d628fbbcb9bb78f632253b7cebe6 (patch) | |
tree | 6f195c47c57b98751467f329f84bd187da074531 /src/cpu | |
parent | 673716deddbd18d03db83defddea98af687f3570 (diff) |
soc/intel/common/thermal: Refactor thermal block to improve reusability
This patch moves common thermal API between chipsets
with thermal device as PCI device and thermal device behind PMC
into common file (thermal_common.c).
Introduce CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_PCI_DEV to let SoC
Kconfig to select as applicable for underlying chipset.
+------------------------------------------------------+--------------+
| Thermal Kconfig | SoC |
+------------------------------------------------------+--------------+
| CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_PCI_DEV | SKL/KBL, CNL |
| | till ICL |
+------------------------------------------------------+--------------+
| CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_BEHIND_PMC | TGL onwards |
| | ICL |
+------------------------------------------------------+--------------+
Either of these two Kconfig internally selects
CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL to use common thermal APIs.
BUG=b:193774296
TEST=Able to build and boot hatch and adlrvp platform.
Change-Id: I14df5145629ef03f358b98e824bca6a5b8ebdfc6
Signed-off-by: Subrata Banik <subrata.banik@intel.com>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/59509
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Angel Pons <th3fanbus@gmail.com>
Reviewed-by: EricR Lai <ericr_lai@compal.corp-partner.google.com>
Reviewed-by: Tim Wawrzynczak <twawrzynczak@chromium.org>
Diffstat (limited to 'src/cpu')
0 files changed, 0 insertions, 0 deletions