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The DIMM manufacturing ID was not being initialized and so the DIMMs
were not described in SMBIOS tables properly.
The module type can also be provided, but the SMBIOS code expects
SPD module type values from DDR2 so the DDR3/4 values are adjusted
before sending to SMBIOS.
BUG=b:134897498
BRANCH=sarien
TEST=dump and compare with dmidecode
BEFORE:
Type: DDR4
Manufacturer: Unknown (0)
Form Factor: Unknown
AFTER:
Type: DDR4
Manufacturer: Hynix/Hyundai
Form Factor: SODIMM
Change-Id: Id673e08aa6e3dad196009c3c21a3dda2f40c9e42
Signed-off-by: Duncan Laurie <dlaurie@google.com>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/33379
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Furquan Shaikh <furquan@google.com>
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Add ECC Support and VDD Voltage to dimm_info struct. Now Bus Width
and ECCSupport will be propagated correctly in SMBIOS Type 17 Entry.
Change-Id: Ic6f0d4b223f1490ec7aa71a6105603635b514021
Signed-off-by: Christian Walter <christian.walter@9elements.com>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/33031
Reviewed-by: Philipp Deppenwiese <zaolin.daisuki@gmail.com>
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
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Fill the DIMM serial number field for SMBIOS from the saved SPD
data that is returned by FSP.
BUG=b:132970635
TEST=This was tested on sarien to ensure that SMBIOS type 17
filled the serial number from the DIMM:
Handle 0x000B, DMI type 17, 40 bytes
Memory Device
Locator: DIMM-A
Serial Number: 41164beb
Change-Id: I85438bd1d581095ea3482dcf077a7f3389f1cd47
Signed-off-by: Duncan Laurie <dlaurie@google.com>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/32853
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Lijian Zhao <lijian.zhao@intel.com>
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"mosys memory spd print all" returns incorrect memory ranks info.
This patch and 2 upcomming ones (one in FSP) will address the issue.
BUG=b:122329046
TEST=Boot to OS on Bobba variant of Octopus
BRANCH=octopus
Change-Id: I212215040e4786c258a9c604cc5c2bb62867c842
Signed-off-by: Francois Toguo <francois.toguo.fotso@intel.com>
Reviewed-on: https://review.coreboot.org/c/31235
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Furquan Shaikh <furquan@google.com>
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The current call for saving dimm info passed the lpddr4_cfg and
memory sku id. In order to prepare decoupling the part number
from lpddr4_cfg provide a new API, save_lpddr4_dimm_info_part_num(),
which explicitly takes the part number. The previous API now
uses the new one internally.
BUG=b:112203105
Change-Id: Ieadf452b6daa3231a0c5e3be61b0603b40d0fff2
Signed-off-by: Aaron Durbin <adurbin@chromium.org>
Reviewed-on: https://review.coreboot.org/27944
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Justin TerAvest <teravest@chromium.org>
Reviewed-by: Furquan Shaikh <furquan@google.com>
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As per FSP 2.0 specification and FSP SOC integration guide, its not expected
that SMBIOS Memory Information GUID will be same for all platform. Hence
fsp_find_smbios_memory_info() function inside common/driver code is not
generic one.
Removing this function and making use of fsp_find_extension_hob_by_guid()
to find SMBIOS Memory Info GUID from platform code as needed.
Change-Id: Ifd5abcd3e0733cedf61fa3dda7230cf3da6b14ce
Signed-off-by: Subrata Banik <subrata.banik@intel.com>
Reviewed-on: https://review.coreboot.org/23650
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Furquan Shaikh <furquan@google.com>
Reviewed-by: Aaron Durbin <adurbin@chromium.org>
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SMBIOS memory HOB produced by glk FSP v52_27 has new structure
members, which are not available in current apl FSP. New FSP-m
header file in https://review.coreboot.org/#/c/20673/ lists new
SMBIOS structure members.
Break memory HOB save routine into different functions for glk
and apl to accomodate new changes.
Change-Id: I33c6e4f2842cebbb326b6a05436fa69e3836ffc6
Signed-off-by: Ravi Sarawadi <ravishankar.sarawadi@intel.com>
Reviewed-on: https://review.coreboot.org/20674
Reviewed-by: Aaron Durbin <adurbin@chromium.org>
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
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