diff options
Diffstat (limited to 'src/vendorcode/amd/agesa/f15tn/Proc/Mem/Tech/DDR3/mttecc3.c')
| -rw-r--r-- | src/vendorcode/amd/agesa/f15tn/Proc/Mem/Tech/DDR3/mttecc3.c | 190 |
1 files changed, 190 insertions, 0 deletions
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Tech/DDR3/mttecc3.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Tech/DDR3/mttecc3.c new file mode 100644 index 0000000000..09bc43cc2b --- /dev/null +++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Tech/DDR3/mttecc3.c @@ -0,0 +1,190 @@ +/* $NoKeywords:$ */ +/** + * @file + * + * mttecc3.c + * + * Technology ECC byte support for registered DDR3 + * + * @xrefitem bom "File Content Label" "Release Content" + * @e project: AGESA + * @e sub-project: (Mem/Tech/DDR3) + * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $ + * + **/ +/***************************************************************************** +* +* Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved. +* +* AMD is granting you permission to use this software (the Materials) +* pursuant to the terms and conditions of your Software License Agreement +* with AMD. This header does *NOT* give you permission to use the Materials +* or any rights under AMD's intellectual property. Your use of any portion +* of these Materials shall constitute your acceptance of those terms and +* conditions. If you do not agree to the terms and conditions of the Software +* License Agreement, please do not use any portion of these Materials. +* +* CONFIDENTIALITY: The Materials and all other information, identified as +* confidential and provided to you by AMD shall be kept confidential in +* accordance with the terms and conditions of the Software License Agreement. +* +* LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION +* PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED +* WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF +* MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE, +* OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE. +* IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER +* (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS +* INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE, +* GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER +* RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF +* THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE +* EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES, +* THE ABOVE LIMITATION MAY NOT APPLY TO YOU. +* +* AMD does not assume any responsibility for any errors which may appear in +* the Materials or any other related information provided to you by AMD, or +* result from use of the Materials or any related information. +* +* You agree that you will not reverse engineer or decompile the Materials. +* +* NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any +* further information, software, technical information, know-how, or show-how +* available to you. Additionally, AMD retains the right to modify the +* Materials at any time, without notice, and is not obligated to provide such +* modified Materials to you. +* +* U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with +* "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is +* subject to the restrictions as set forth in FAR 52.227-14 and +* DFAR252.227-7013, et seq., or its successor. Use of the Materials by the +* Government constitutes acknowledgement of AMD's proprietary rights in them. +* +* EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any +* direct product thereof will be exported directly or indirectly, into any +* country prohibited by the United States Export Administration Act and the +* regulations thereunder, without the required authorization from the U.S. +* government nor will be used for any purpose prohibited by the same. +* *************************************************************************** +* +*/ + +/* + *---------------------------------------------------------------------------- + * MODULES USED + * + *---------------------------------------------------------------------------- + */ + + +#include "AGESA.h" +#include "mm.h" +#include "mn.h" +#include "mt.h" +#include "Filecode.h" +CODE_GROUP (G1_PEICC) +RDATA_GROUP (G1_PEICC) + +#define FILECODE PROC_MEM_TECH_DDR3_MTTECC3_FILECODE +/*---------------------------------------------------------------------------- + * DEFINITIONS AND MACROS + * + *---------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * TYPEDEFS AND STRUCTURES + * + *---------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * PROTOTYPES OF LOCAL FUNCTIONS + * + *---------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * EXPORTED FUNCTIONS + * + *---------------------------------------------------------------------------- + */ + +/* -----------------------------------------------------------------------------*/ +/** + * + * This function sets the DQS ECC timings for registered DDR3 + * + * @param[in,out] *TechPtr - Pointer to the MEM_TECH_BLOCK + * + * @return TRUE - No fatal error occurs. + * @return FALSE - Fatal error occurs. + */ + +BOOLEAN +MemTSetDQSEccTmgsRDdr3 ( + IN OUT MEM_TECH_BLOCK *TechPtr + ) +{ + UINT8 Dct; + UINT8 Dimm; + UINT8 i; + UINT8 *WrDqsDly; + UINT16 *RcvEnDly; + UINT8 *RdDqsDly; + UINT8 *WrDatDly; + UINT8 EccByte; + INT16 TempValue; + + MEM_NB_BLOCK *NBPtr; + CH_DEF_STRUCT *ChannelPtr; + + EccByte = TechPtr->MaxByteLanes (); + NBPtr = TechPtr->NBPtr; + + if (NBPtr->MCTPtr->NodeMemSize) { + for (Dct = 0; Dct < NBPtr->DctCount; Dct++) { + NBPtr->SwitchDCT (NBPtr, Dct); + if (NBPtr->DCTPtr->Timings.DctMemSize != 0) { + ChannelPtr = NBPtr->ChannelPtr; + for (Dimm = 0; Dimm < MAX_DIMMS_PER_CHANNEL; Dimm++) { + if (NBPtr->DCTPtr->Timings.CsEnabled & ((UINT16)3 << (Dimm * 2))) { + i = Dimm * TechPtr->DlyTableWidth (); + WrDqsDly = &ChannelPtr->WrDqsDlys[i]; + RcvEnDly = &ChannelPtr->RcvEnDlys[i]; + RdDqsDly = &ChannelPtr->RdDqsDlys[i]; + WrDatDly = &ChannelPtr->WrDatDlys[i]; + // Receiver DQS Enable: + // Receiver DQS enable for ECC bytelane = Receiver DQS enable for bytelane 3 - + // [write DQS for bytelane 3 - write DQS for ECC] + + TempValue = (INT16) RcvEnDly[3] - (INT16) (WrDqsDly[3] - WrDqsDly[EccByte]); + if (TempValue < 0) { + TempValue = 0; + } + RcvEnDly[EccByte] = (UINT16) TempValue; + + // Read DQS: + // Read DQS for ECC bytelane = read DQS of byte lane 3 + // + RdDqsDly[EccByte] = RdDqsDly[3]; + + // Write Data: + // Write Data for ECC bytelane = Write DQS for ECC + + // [write data for bytelane 3 - Write DQS for bytelane 3] + TempValue = (INT16) (WrDqsDly[EccByte] + (INT8) (WrDatDly[3] - WrDqsDly[3])); + if (TempValue < 0) { + TempValue = 0; + } + WrDatDly[EccByte] = (UINT8) TempValue; + + NBPtr->SetTrainDly (NBPtr, AccessRcvEnDly, DIMM_BYTE_ACCESS (Dimm, EccByte), RcvEnDly[EccByte]); + NBPtr->SetTrainDly (NBPtr, AccessRdDqsDly, DIMM_BYTE_ACCESS (Dimm, EccByte), RdDqsDly[EccByte]); + NBPtr->SetTrainDly (NBPtr, AccessWrDatDly, DIMM_BYTE_ACCESS (Dimm, EccByte), WrDatDly[EccByte]); + } + } + } + } + } + return (BOOLEAN) (NBPtr->MCTPtr->ErrCode < AGESA_FATAL); +}
\ No newline at end of file |