aboutsummaryrefslogtreecommitdiff
path: root/src/vendorcode/amd/agesa/f10/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h
diff options
context:
space:
mode:
Diffstat (limited to 'src/vendorcode/amd/agesa/f10/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h')
-rwxr-xr-xsrc/vendorcode/amd/agesa/f10/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h78
1 files changed, 78 insertions, 0 deletions
diff --git a/src/vendorcode/amd/agesa/f10/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h b/src/vendorcode/amd/agesa/f10/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h
new file mode 100755
index 0000000000..1ea7c2490b
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f10/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h
@@ -0,0 +1,78 @@
+/**
+ * @file
+ *
+ * mfodthermal.h
+ *
+ * Header file for On-Dimm thermal management.
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem)
+ * @e \$Revision: 6609 $ @e \$Date: 2008-07-02 17:11:21 -0500 (Wed, 02 Jul 2008) $
+ *
+ **/
+/*****************************************************************************
+*
+* Copyright (c) 2011, Advanced Micro Devices, Inc.
+* All rights reserved.
+*
+* Redistribution and use in source and binary forms, with or without
+* modification, are permitted provided that the following conditions are met:
+* * Redistributions of source code must retain the above copyright
+* notice, this list of conditions and the following disclaimer.
+* * Redistributions in binary form must reproduce the above copyright
+* notice, this list of conditions and the following disclaimer in the
+* documentation and/or other materials provided with the distribution.
+* * Neither the name of Advanced Micro Devices, Inc. nor the names of
+* its contributors may be used to endorse or promote products derived
+* from this software without specific prior written permission.
+*
+* THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS" AND
+* ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED
+* WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE
+* DISCLAIMED. IN NO EVENT SHALL ADVANCED MICRO DEVICES, INC. BE LIABLE FOR ANY
+* DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES
+* (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES;
+* LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND
+* ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT
+* (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS
+* SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
+*
+* ***************************************************************************
+*
+*/
+
+#ifndef _MFODTHERMAL_H_
+#define _MFODTHERMAL_H_
+
+/*----------------------------------------------------------------------------
+ * Mixed (DEFINITIONS AND MACROS / TYPEDEFS, STRUCTURES, ENUMS)
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*-----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *-----------------------------------------------------------------------------
+ */
+#define THERMAL_OPT 31
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS, STRUCTURES, ENUMS
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * FUNCTIONS PROTOTYPE
+ *
+ *----------------------------------------------------------------------------
+ */
+
+BOOLEAN
+MemFOnDimmThermal (
+ IN OUT MEM_NB_BLOCK *NBPtr
+ );
+
+#endif //_MFODTHERMAL_H_