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+# PCEngines 2Gb 1333
+
+# SPD contents for APU 2GB DDR3 NO ECC (1333MHz PC1333) soldered down
+# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage
+# bits[3:0]: 1 = 128 SPD Bytes Used
+# bits[6:4]: 1 = 256 SPD Bytes Total
+# bit7 : 0 = CRC covers bytes 0 ~ 128
+01
+
+# 1 SPD Revision
+# 0x13 = Revision 1.3
+13
+
+# 2 Key Byte / DRAM Device Type
+# bits[7:0]: 0x0b = DDR3 SDRAM
+0B
+
+# 3 Key Byte / Module Type
+# bits[3:0]: 3 = SO-DIMM
+# bits[3:0]: 8 = 72b-SO-DIMM
+# bits[7:4]: reserved
+03
+
+# 4 SDRAM CHIP Density and Banks
+# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip
+# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip
+# bits[6:4]: 0 = 3 (8 banks)
+# bit7 : reserved
+03
+
+# 5 SDRAM Addressing
+# bits[2:0]: 1 = 10 Column Address Bits
+# bits[5:3]: 4 = 16 Row Address Bits
+# bits[5:3]: 3 = 15 Row Address Bits
+# bits[5:3]: 2 = 14 Row Address Bits
+# bits[7:6]: reserved
+19
+
+# 6 Module Nominal Voltage, VDD
+# bit0 : 0 = 1.5 V operable
+# bit1 : 0 = NOT 1.35 V operable
+# bit2 : 0 = NOT 1.25 V operable
+# bits[7:3]: reserved
+00
+
+# 7 Module Organization
+# bits[2:0]: 1 = 8 bits
+# bits[2:0]: 2 = 16 bits
+# bits[5:3]: 0 = 1 Rank
+# bits[7:6]: reserved
+01
+
+# 8 Module Memory Bus Width
+# bits[2:0]: 3 = Primary bus width is 64 bits
+# bits[4:3]: 0 = 0 bits (no bus width extension)
+# bits[4:3]: 1 = 8 bits (for ECC)
+# bits[7:5]: reserved
+03
+
+# 9 Fine Timebase (FTB) Dividend / Divisor
+# bits[3:0]: 0x02 divisor
+# bits[7:4]: 0x05 dividend
+# 5 / 2 = 2.5ps
+52
+
+# 10 Medium Timebase (MTB) Dividend
+# 11 Medium Timebase (MTB) Divisor
+# 1 / 8 = .125 ns
+01 08
+
+# 12 SDRAM Minimum Cycle Time (tCKmin)
+# 0x0a = tCKmin of 1.25 ns = DDR3-1600 (800 MHz clock)
+# 0x0c = tCKmin of 1.5 ns = DDR3-1333 (667 MHz clock)
+# 0x0c = tCKmin of 1.5 ns = in multiples of MTB
+0C
+
+# 13 Reserved
+00
+
+# 14 CAS Latencies Supported, Least Significant Byte
+# 15 CAS Latencies Supported, Most Significant Byte
+# Cas Latencies of 11 - 5 are supported
+7E 00
+
+# 16 Minimum CAS Latency Time (tAAmin)
+# 0x6C = 13.5ns - DDR3-1333
+# 0x69 = 13.125 ns - DDR3-1333
+69
+
+# 17 Minimum Write Recovery Time (tWRmin)
+# 0x78 = tWR of 15ns - All DDR3 speed grades
+78
+
+# 18 Minimum RAS# to CAS# Delay Time (tRCDmin)
+# 0x6E = 13.5ns - DDR3-1333
+# 0x69 = 13.125 ns - DDR3-1333
+69
+
+# 19 Minimum Row Active to Row Active Delay Time (tRRDmin)
+# 0x30 = 6.0ns
+# 0x38 = 7.0ns
+# 0x3C = 7.5ns
+30
+
+# 20 Minimum Row Precharge Delay Time (tRPmin)
+# 0x6C = 13.5ns -
+# 0x69 = 13.125 ns - DDR3-1333
+69
+
+# 21 Upper Nibbles for tRAS and tRC
+# bits[3:0]: tRAS most significant nibble = 1 (see byte 22)
+# bits[7:4]: tRC most significant nibble = 1 (see byte 23)
+11
+
+# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB
+# 0x120 = 36ns - DDR3-1333 (see byte 21)
+# 0x120 = 36ns - DDR3
+20
+
+# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB
+# 0x289 = 49.125ns - DDR3-1333
+89
+
+# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB
+# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB
+# 0x500 = 160ns - for 2 Gigabit chips
+# 0x820 = 260ns - for 4 Gigabit chips
+00 05
+
+# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin)
+# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins
+3C
+
+# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin)
+# 0x3c = 7.5ns - All DDR3 SDRAM speed bins
+3C
+
+# 28 Upper Nibble for tFAWmin
+# 29 Minimum Four Activate Window Delay Time (tFAWmin)
+# 0x00F0 = 30ns - DDR3-1333, 1 KB page size
+00 F0
+
+# 30 SDRAM Optional Feature
+# bit0 : 1= RZQ/6 supported
+# bit1 : 1 = RZQ/7 supported
+# bits[6:2]: reserved
+# bit7 : 1 = DLL Off mode supported
+83
+
+# 31 SDRAM Thermal and Refresh Options
+# bit0 : 1 = Temp up to 95c supported
+# bit1 : 0 = 85-95c uses 2x refresh rate
+# bit2 : 1 = Auto Self Refresh supported
+# bit3 : 0 = no on die thermal sensor
+# bits[6:4]: reserved
+# bit7 : 0 = partial self refresh supported
+01
+
+# 32 Module Thermal Sensor
+# 0 = Thermal sensor not incorporated onto this assembly
+00
+
+# 33 SDRAM Device Type
+# bits[1:0]: 0 = Signal Loading not specified
+# bits[3:2]: reserved
+# bits[6:4]: 0 = Die count not specified
+# bit7 : 0 = Standard Monolithic DRAM Device
+00
+
+# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin)
+00
+
+# 35 Fine Offset for Minimum CAS Latency Time (tAAmin)
+00
+
+# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin)
+00
+
+# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin)
+00
+
+# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin)
+00
+
+# 39 40 (reserved)
+00 00
+
+# 41 tMAW, MAC
+# 8K*tREFI / 200k
+86
+
+# 42 - 47 (reserved)
+00 00 00 00 00 00
+
+# 48 - 55 (reserved)
+00 00 00 00 00 00 00 00
+
+# 56 - 59 (reserved)
+00 00 00 00
+
+# 60 Raw Card Extension, Module Nominal Height
+# bits[4:0]: 0 = <= 15mm tall
+# bits[7:5]: 0 = raw card revision 0-3
+00
+
+# 61 Module Maximum Thickness
+# bits[3:0]: 0 = thickness front <= 1mm
+# bits[7:4]: 0 = thinkness back <= 1mm
+00
+
+# 62 Reference Raw Card Used
+# bits[4:0]: 0 = Reference Raw card A used
+# bits[6:5]: 0 = revision 0
+# bit7 : 0 = Reference raw cards A through AL
+# revision B4
+61
+
+# 63 Address Mapping from Edge Connector to DRAM
+# bit0 : 0 = standard mapping (not mirrored)
+# bits[7:1]: reserved
+00
+
+# 64 - 71 (reserved)
+00 00 00 00 00 00 00 00
+
+# 72 - 79 (reserved)
+00 00 00 00 00 00 00 00
+
+# 80 - 87 (reserved)
+00 00 00 00 00 00 00 00
+
+# 88 - 95 (reserved)
+00 00 00 00 00 00 00 00
+
+# 96 - 103 (reserved)
+00 00 00 00 00 00 00 00
+
+# 104 - 111 (reserved)
+00 00 00 00 00 00 00 00
+
+# 112 - 116 (reserved)
+00 00 00 00 00
+
+# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code
+# 0x0001 = AMD
+00 01
+
+# 119 Module ID: Module Manufacturing Location - OEM specified
+00
+
+# 120 Module ID: Module Manufacture Year in BCD
+# 0x15 = 2015
+15
+
+# 121 Module ID: Module Manufacture week
+# 0x44 = 44th week
+44
+
+# 122 - 125: Module Serial Number
+00 00 00 00
+
+# 126 - 127: Cyclical Redundancy Code
+b6 73
+