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authorLean Sheng Tan <lean.sheng.tan@intel.com>2021-06-08 21:41:42 -0700
committerWerner Zeh <werner.zeh@siemens.com>2021-06-11 05:52:03 +0000
commita96be277e1062796be7109a08a9ab9cdb6bf5d28 (patch)
tree82f7e6433049613a67f6c831ae4044b5947b92e1 /util/uio_usbdebug/README
parent08938a9be3fd5f02650926f87d00d0029fafc3c2 (diff)
soc/intel/elkhartlake: Update FSP-S PM & Thermal related configs
Further add initial Silicon UPD settings for thermal and power management stuffs. Signed-off-by: Lean Sheng Tan <lean.sheng.tan@intel.com> Change-Id: I04ded059c36f18925b7a74c934fef2566c3db8fa Reviewed-on: https://review.coreboot.org/c/coreboot/+/55335 Tested-by: build bot (Jenkins) <no-reply@coreboot.org> Reviewed-by: Werner Zeh <werner.zeh@siemens.com>
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