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author | Julius Werner <jwerner@chromium.org> | 2019-06-06 22:09:42 -0700 |
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committer | Julius Werner <jwerner@chromium.org> | 2019-06-10 18:01:15 +0000 |
commit | 381c35c7f901608277f00477e04977bf938b0b59 (patch) | |
tree | a62a699a2bf292e39dcc3ac1d92fcb0c60028377 /src/soc/qualcomm/sdm845/spi.c | |
parent | 8dcf24fcbf5746693ae0227e9cdfb486efb4907e (diff) |
spi_flash: gigadevice: Adopt Winbond chip info structure
This patch changes the Gigadevice SPI flash driver to adopt the same
structure packing improvements for the hardcoded parameters of
individual chips that was implemented for Winbond last year. This cuts
the size of the hardcoded info nearly in half and should save us a few
hundred bytes in every stage.
Change-Id: I9910dcb9b649f51b317f3f8fcba49e5e893f67d2
Signed-off-by: Julius Werner <jwerner@chromium.org>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/33285
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Aaron Durbin <adurbin@chromium.org>
Reviewed-by: Furquan Shaikh <furquan@google.com>
Diffstat (limited to 'src/soc/qualcomm/sdm845/spi.c')
0 files changed, 0 insertions, 0 deletions