diff options
author | Fabian Kunkel <fabi@adv.bruhnspace.com> | 2016-07-27 17:42:39 +0200 |
---|---|---|
committer | Kyösti Mälkki <kyosti.malkki@gmail.com> | 2016-07-30 06:51:13 +0200 |
commit | cf05183d1f952a903057038aee3a71698ce564b0 (patch) | |
tree | f7e46a4f70131066396b7c519ba661c4a51e43c1 /src/mainboard | |
parent | 171e2c965aef8b47d39611280121fd2b66136df4 (diff) |
mainboard/bap/ode_e21XX: Add board support
Add next generation of BAPs (https://www.unibap.com/) SOC module,
called ode_e21XX.
Hardware is similar to e20XX (AMD G-Series GX-411GA Kabini),
but it includes a new AMD G-Series GX-412HC (Steppe Eagle)
and an updated Microsemi FPGA.
Changes to Olivehillplus:
- Add SuperIO Fintek F81866D
- Soldered down DDR3 with ECC
- User can choose between different DDR3 clk settings
(lowest setting can save up to 1.2W)
- Soldered down Microsemi M2S060 FPGA on PCIe lanes 2-3
Tested with:
- Payload SeaBIOS 1.9.1
- Lubuntu 16.04, Kernel 4.4.0
- Windows 10 (UART functionality)
Known problems:
- S3 not working
- IOMMU not working
Change-Id: I41f6a3334ad2128695a3f7c0a6444f1678d2626e
Signed-off-by: Fabian Kunkel <fabi@adv.bruhnspace.com>
Reviewed-on: https://review.coreboot.org/15918
Tested-by: build bot (Jenkins)
Reviewed-by: Kyösti Mälkki <kyosti.malkki@gmail.com>
Reviewed-by: Paul Menzel <paulepanter@users.sourceforge.net>
Diffstat (limited to 'src/mainboard')
-rw-r--r-- | src/mainboard/bap/ode_e21XX/BAP_Q7_1066.spd.hex | 231 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/BAP_Q7_1333.spd.hex | 231 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/BAP_Q7_800.spd.hex | 231 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/BiosCallOuts.c | 34 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/Kconfig | 23 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/Makefile.inc | 20 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/OemCustomize.c | 28 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/acpi/superio.asl | 48 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/board_info.txt | 4 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/devicetree.cb | 80 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/dsdt.asl | 2 | ||||
-rw-r--r-- | src/mainboard/bap/ode_e21XX/romstage.c | 16 |
12 files changed, 894 insertions, 54 deletions
diff --git a/src/mainboard/bap/ode_e21XX/BAP_Q7_1066.spd.hex b/src/mainboard/bap/ode_e21XX/BAP_Q7_1066.spd.hex new file mode 100644 index 0000000000..507c9f1174 --- /dev/null +++ b/src/mainboard/bap/ode_e21XX/BAP_Q7_1066.spd.hex @@ -0,0 +1,231 @@ +# +# This file is part of the coreboot project. +# +# Copyright (C) 2014 Sage Electronic Engineering, LLC. +# Copyright (C) 2015 BAP - Bruhnspace Advanced Projects +# (Written by Fabian Kunkel <fabi@adv.bruhnspace.com> for BAP) +# +# This program is free software; you can redistribute it and/or modify +# it under the terms of the GNU General Public License as published by +# the Free Software Foundation; version 2 of the License. +# +# This program is distributed in the hope that it will be useful, +# but WITHOUT ANY WARRANTY; without even the implied warranty of +# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the +# GNU General Public License for more details. + +# Memory chip: Hynix H5TQ4G63MFR-PBC with ECC +# BAP ODE E21XX has 2GB ram soldered down on the Q7 +# Memory setting for DDR-1066 + +# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage +# bits[3:0]: 1 = 128 SPD Bytes Used +# bits[6:4]: 1 = 256 SPD Bytes Total +# bit7 : 0 = CRC covers bytes 0 ~ 125 +11 + +# 1 SPD Revision - +# 0x12 = Revision 1.2 +12 + +# 2 Key Byte / DRAM Device Type +# bits[7:0]: 0x0b = DDR3 SDRAM +0B + +# 3 Key Byte / Module Type +# bits[3:0]: 3 = SO-DIMM +# bits[7:4]: reserved +03 + +# 4 SDRAM CHIP Density and Banks +# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip +# bits[6:4]: 0 = 3 (8 banks) +# bit7 : reserved +04 + +# 5 SDRAM Addressing +# bits[2:0]: 1 = 10 Column Address Bits +# bits[5:3]: 3 = 15 Row Address Bits +# bits[7:6]: reserved +19 + +# 6 Module Nominal Voltage, VDD +# bit0 : 0 = 1.5 V operable +# bit1 : 0 = NOT 1.35 V operable +# bit2 : 0 = NOT 1.25 V operable +# bits[7:3]: reserved +00 + +# 7 Module Organization +# bits[2:0]: 2 = 16 bits +# bits[5:3]: 0 = 1 Rank +# bits[7:6]: reserved +02 + +# 8 Module Memory Bus Width +# bits[2:0]: 3 = Primary bus width is 64 bits +# bits[4:3]: 1 = 1 bit (bus width extension ECC) +# bits[7:5]: reserved +0B + +# 9 Fine Timebase (FTB) Dividend / Divisor +# bits[3:0]: 0x01 divisor +# bits[7:4]: 0x01 dividend +# 1/1 = 1ps +11 + +# 10 Medium Timebase (MTB) Dividend +# 11 Medium Timebase (MTB) Divisor +# 1 / 8 = .125 ns - used for DDR3 +01 08 + +# 12 SDRAM Minimum Cycle Time (tCKmin) +# 0x0F = tCKmin of 1.875 ns = DDR3-1066 (533 MHz clock) +0F + +# 13 Reserved +00 + +# 14 CAS Latencies Supported, Least Significant Byte +# 15 CAS Latencies Supported, Most Significant Byte +# Cas Latencies of 8 - 5 are supported +1E 00 + +# 16 Minimum CAS Latency Time (tAAmin) +# 0x69 = 13.125ns - DDR3-1066F +69 + +# 17 Minimum Write Recovery Time (tWRmin) +# 0x78 = tWR of 15ns - All DDR3 speed grades +78 + +# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) +# 0x69 = 13.125ns - DDR3-1066F +69 + +# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) +# 0x3C = 7.5ns +3C + +# 20 Minimum Row Precharge Delay Time (tRPmin) +# 0x69 = 13.125ns - DDR3-1066F +69 + +# 21 Upper Nibbles for tRAS and tRC +# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) +# bits[7:4]: tRC most significant nibble = 1 (see byte 23) +11 + +# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB +# 0x12C = 37.5ns - DDR3-1066 (see byte 21) +2C + +# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB +# 0x195 = 50.625ns - DDR3-1066F (see byte 21) +95 + +# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB +# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB +# 0x500 = 160ns - for 2 Gigabit chips +80 07 + +# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) +# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins +3C + +# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) +# 0x3c = 7.5ns - All DDR3 SDRAM speed bins +3C + +# 28 Upper Nibble for tFAWmin +# 29 Minimum Four Activate Window Delay Time (tFAWmin) +# 0x0190 = 50ns - DDR3-1066, 2 KB page size +01 90 + +# 30 SDRAM Optional Feature +# bit0 : 1= RZQ/6 supported +# bit1 : 1 = RZQ/7 supported +# bits[6:2]: reserved +# bit7 : 0 = DLL Off mode supported +03 + +# 31 SDRAM Thermal and Refresh Options +# bit0 : 0 = Temp up to 95c supported +# bit1 : 0 = 85-95c uses 2x refresh rate +# bit2 : 1 = Auto Self Refresh supported +# bit3 : 0 = no on die thermal sensor +# bits[6:4]: reserved +# bit7 : 0 = partial self refresh supported +04 + +# 32 Module Thermal Sensor +# 0 = Thermal sensor not incorporated onto this assembly +00 + +# 33 SDRAM Device Type +# bits[1:0]: 0 = Signal Loading not specified +# bits[3:2]: reserved +# bits[6:4]: 0 = Die count not specified +# bit7 : 0 = Standard Monolithic DRAM Device +00 + +# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) +# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) +# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) +# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) +# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) +00 00 00 00 00 + +# 39 - 59 (reserved) +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 + +# 60 Raw Card Extension, Module Nominal Height +# bits[4:0]: 0 = <= 15mm tall +# bits[7:5]: 0 = raw card revision 0-3 +00 + +# 61 Module Maximum Thickness +# bits[3:0]: 0 = thickness front <= 1mm +# bits[7:4]: 0 = thinkness back <= 1mm +00 + +# 62 Reference Raw Card Used +# bits[4:0]: 0 = Reference Raw card A used +# bits[6:5]: 0 = revision 0 +# bit7 : 0 = Reference raw cards A through AL +00 + +# 63 Address Mapping from Edge Connector to DRAM +# bit0 : 0 = standard mapping (not mirrored) +# bits[7:1]: reserved +00 + +# 64 - 116 (reserved) +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 + +# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code +# 0x80AD = Hynix +80 AD + +# 119 Module ID: Module Manufacturing Location - oem specified +# 120 Module ID: Module Manufacture Year in BCD +# 0x00 = 2000 +00 00 + +# 121 Module ID: Module Manufacture week +# 0x00 = 0th week +00 + +# 122 - 125: Module Serial Number +00 00 00 00 + +# 126 - 127: Cyclical Redundancy Code +E9 40 diff --git a/src/mainboard/bap/ode_e21XX/BAP_Q7_1333.spd.hex b/src/mainboard/bap/ode_e21XX/BAP_Q7_1333.spd.hex new file mode 100644 index 0000000000..1991f84fb2 --- /dev/null +++ b/src/mainboard/bap/ode_e21XX/BAP_Q7_1333.spd.hex @@ -0,0 +1,231 @@ +# +# This file is part of the coreboot project. +# +# Copyright (C) 2014 Sage Electronic Engineering, LLC. +# Copyright (C) 2015 BAP - Bruhnspace Advanced Projects +# (Written by Fabian Kunkel <fabi@adv.bruhnspace.com> for BAP) +# +# This program is free software; you can redistribute it and/or modify +# it under the terms of the GNU General Public License as published by +# the Free Software Foundation; version 2 of the License. +# +# This program is distributed in the hope that it will be useful, +# but WITHOUT ANY WARRANTY; without even the implied warranty of +# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the +# GNU General Public License for more details. + +# Memory chip: Hynix H5TQ4G63MFR-PBC with ECC +# BAP ODE E21XX has 2GB ram soldered down on the Q7 +# Memory setting for DDR-1333 + +# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage +# bits[3:0]: 1 = 128 SPD Bytes Used +# bits[6:4]: 1 = 256 SPD Bytes Total +# bit7 : 0 = CRC covers bytes 0 ~ 125 +11 + +# 1 SPD Revision - +# 0x13 = Revision 1.3 +13 + +# 2 Key Byte / DRAM Device Type +# bits[7:0]: 0x0b = DDR3 SDRAM +0B + +# 3 Key Byte / Module Type +# bits[3:0]: 3 = SO-DIMM +# bits[7:4]: reserved +03 + +# 4 SDRAM CHIP Density and Banks +# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip +# bits[6:4]: 0 = 3 (8 banks) +# bit7 : reserved +04 + +# 5 SDRAM Addressing +# bits[2:0]: 1 = 10 Column Address Bits +# bits[5:3]: 3 = 15 Row Address Bits +# bits[7:6]: reserved +19 + +# 6 Module Nominal Voltage, VDD +# bit0 : 0 = 1.5 V operable +# bit1 : 0 = NOT 1.35 V operable +# bit2 : 0 = NOT 1.25 V operable +# bits[7:3]: reserved +00 + +# 7 Module Organization +# bits[2:0]: 2 = 16 bits +# bits[5:3]: 0 = 1 Rank +# bits[7:6]: reserved +02 + +# 8 Module Memory Bus Width +# bits[2:0]: 3 = Primary bus width is 64 bits +# bits[4:3]: 1 = 1 bit (bus width extension ECC) +# bits[7:5]: reserved +0B + +# 9 Fine Timebase (FTB) Dividend / Divisor +# bits[3:0]: 0x01 divisor +# bits[7:4]: 0x01 dividend +# 1/1 = 1ps +11 + +# 10 Medium Timebase (MTB) Dividend +# 11 Medium Timebase (MTB) Divisor +# 1 / 8 = .125 ns - used for DDR3 +01 08 + +# 12 SDRAM Minimum Cycle Time (tCKmin) +# 0x0C = tCKmin of 1.5 ns = DDR3-1333 (667 MHz clock) +0C + +# 13 Reserved +00 + +# 14 CAS Latencies Supported, Least Significant Byte +# 15 CAS Latencies Supported, Most Significant Byte +# Cas Latencies of 9 - 5 are supported (no 7) +36 00 + +# 16 Minimum CAS Latency Time (tAAmin) +# 0x6C = 13.5ns - DDR3-1333H +6C + +# 17 Minimum Write Recovery Time (tWRmin) +# 0x78 = tWR of 15ns - All DDR3 speed grades +78 + +# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) +# 0x6C = 13.5ns - DDR3-1333H +6C + +# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) +# 0x3C = 7.5ns +3C + +# 20 Minimum Row Precharge Delay Time (tRPmin) +# 0x6C = 13.5ns - DDR3-1333H +6C + +# 21 Upper Nibbles for tRAS and tRC +# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) +# bits[7:4]: tRC most significant nibble = 1 (see byte 23) +11 + +# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB +# 0x120 = 36ns - DDR3-1333 (see byte 21) +20 + +# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB +# 0x18C = 49.5ns - DDR3-1333H (see byte 21) +8C + +# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB +# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB +# 0x500 = 160ns - for 2 Gigabit chips +80 07 + +# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) +# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins +3C + +# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) +# 0x3c = 7.5ns - All DDR3 SDRAM speed bins +3C + +# 28 Upper Nibble for tFAWmin +# 29 Minimum Four Activate Window Delay Time (tFAWmin) +# 0x0168 = 45ns - DDR3-1333, 2 KB page size +01 68 + +# 30 SDRAM Optional Feature +# bit0 : 1= RZQ/6 supported +# bit1 : 1 = RZQ/7 supported +# bits[6:2]: reserved +# bit7 : 0 = DLL Off mode supported +03 + +# 31 SDRAM Thermal and Refresh Options +# bit0 : 0 = Temp up to 95c supported +# bit1 : 0 = 85-95c uses 2x refresh rate +# bit2 : 1 = Auto Self Refresh supported +# bit3 : 0 = no on die thermal sensor +# bits[6:4]: reserved +# bit7 : 0 = partial self refresh supported +04 + +# 32 Module Thermal Sensor +# 0 = Thermal sensor not incorporated onto this assembly +00 + +# 33 SDRAM Device Type +# bits[1:0]: 0 = Signal Loading not specified +# bits[3:2]: reserved +# bits[6:4]: 0 = Die count not specified +# bit7 : 0 = Standard Monolithic DRAM Device +00 + +# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) +# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) +# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) +# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) +# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) +00 00 00 00 00 + +# 39 - 59 (reserved) +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 + +# 60 Raw Card Extension, Module Nominal Height +# bits[4:0]: 0 = <= 15mm tall +# bits[7:5]: 0 = raw card revision 0-3 +00 + +# 61 Module Maximum Thickness +# bits[3:0]: 0 = thickness front <= 1mm +# bits[7:4]: 0 = thinkness back <= 1mm +00 + +# 62 Reference Raw Card Used +# bits[4:0]: 0 = Reference Raw card A used +# bits[6:5]: 0 = revision 0 +# bit7 : 0 = Reference raw cards A through AL +00 + +# 63 Address Mapping from Edge Connector to DRAM +# bit0 : 0 = standard mapping (not mirrored) +# bits[7:1]: reserved +00 + +# 64 - 116 (reserved) +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 + +# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code +# 0x80AD = Hynix +80 AD + +# 119 Module ID: Module Manufacturing Location - oem specified +# 120 Module ID: Module Manufacture Year in BCD +# 0x00 = 2000 +00 00 + +# 121 Module ID: Module Manufacture week +# 0x00 = 0th week +00 + +# 122 - 125: Module Serial Number +00 00 00 00 + +# 126 - 127: Cyclical Redundancy Code +95 b9 diff --git a/src/mainboard/bap/ode_e21XX/BAP_Q7_800.spd.hex b/src/mainboard/bap/ode_e21XX/BAP_Q7_800.spd.hex new file mode 100644 index 0000000000..e657179405 --- /dev/null +++ b/src/mainboard/bap/ode_e21XX/BAP_Q7_800.spd.hex @@ -0,0 +1,231 @@ +# +# This file is part of the coreboot project. +# +# Copyright (C) 2014 Sage Electronic Engineering, LLC. +# Copyright (C) 2015 BAP - Bruhnspace Advanced Projects +# (Written by Fabian Kunkel <fabi@adv.bruhnspace.com> for BAP) +# +# This program is free software; you can redistribute it and/or modify +# it under the terms of the GNU General Public License as published by +# the Free Software Foundation; version 2 of the License. +# +# This program is distributed in the hope that it will be useful, +# but WITHOUT ANY WARRANTY; without even the implied warranty of +# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the +# GNU General Public License for more details. + +# Memory chip: Hynix H5TQ4G63MFR-PBC with ECC +# BAP ODE E21XX has 2GB ram soldered down on the Q7 +# Memory setting for DDR-800 + +# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage +# bits[3:0]: 1 = 128 SPD Bytes Used +# bits[6:4]: 1 = 256 SPD Bytes Total +# bit7 : 0 = CRC covers bytes 0 ~ 125 +11 + +# 1 SPD Revision - +# 0x11 = Revision 1.1 +11 + +# 2 Key Byte / DRAM Device Type +# bits[7:0]: 0x0b = DDR3 SDRAM +0B + +# 3 Key Byte / Module Type +# bits[3:0]: 3 = SO-DIMM +# bits[7:4]: reserved +03 + +# 4 SDRAM CHIP Density and Banks +# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip +# bits[6:4]: 0 = 3 (8 banks) +# bit7 : reserved +04 + +# 5 SDRAM Addressing +# bits[2:0]: 1 = 10 Column Address Bits +# bits[5:3]: 3 = 15 Row Address Bits +# bits[7:6]: reserved +19 + +# 6 Module Nominal Voltage, VDD +# bit0 : 0 = 1.5 V operable +# bit1 : 0 = NOT 1.35 V operable +# bit2 : 0 = NOT 1.25 V operable +# bits[7:3]: reserved +00 + +# 7 Module Organization +# bits[2:0]: 2 = 16 bits +# bits[5:3]: 0 = 1 Rank +# bits[7:6]: reserved +02 + +# 8 Module Memory Bus Width +# bits[2:0]: 3 = Primary bus width is 64 bits +# bits[4:3]: 1 = 1 bit (bus width extension ECC) +# bits[7:5]: reserved +0B + +# 9 Fine Timebase (FTB) Dividend / Divisor +# bits[3:0]: 0x01 divisor +# bits[7:4]: 0x01 dividend +# 1/1 = 1ps +11 + +# 10 Medium Timebase (MTB) Dividend +# 11 Medium Timebase (MTB) Divisor +# 1 / 8 = .125 ns - used for DDR3 +01 08 + +# 12 SDRAM Minimum Cycle Time (tCKmin) +# 0x14 = tCKmin of 2.5 ns = DDR3-800 (400 MHz clock) +14 + +# 13 Reserved +00 + +# 14 CAS Latencies Supported, Least Significant Byte +# 15 CAS Latencies Supported, Most Significant Byte +# CAS Latencies of 6 - 5 are supported +06 00 + +# 16 Minimum CAS Latency Time (tAAmin) +# 0x78 = 15ns - DDR3-800E +78 + +# 17 Minimum Write Recovery Time (tWRmin) +# 0x78 = tWR of 15ns - All DDR3 speed grades +78 + +# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) +# 0x6E = 15ns - DDR3-800E +78 + +# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) +# 0x3C = 7.5ns +3C + +# 20 Minimum Row Precharge Delay Time (tRPmin) +# 0x6E = 15ns - DDR3-800E +78 + +# 21 Upper Nibbles for tRAS and tRC +# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) +# bits[7:4]: tRC most significant nibble = 1 (see byte 23) +11 + +# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB +# 0x12C = 37.5ns - DDR3-800E (see byte 21) +2C + +# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB +# 0x1A4 = 52.5ns - DDR3-800E (see byte 21) +A4 + +# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB +# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB +# 0x780 = 208ns - for 4 Gigabit chips +80 07 + +# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) +# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins +3C + +# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) +# 0x3c = 7.5ns - All DDR3 SDRAM speed bins +3C + +# 28 Upper Nibble for tFAWmin +# 29 Minimum Four Activate Window Delay Time (tFAWmin) +# 0x0190 = 50ns - DDR3-800, 2 KB page size +01 90 + +# 30 SDRAM Optional Feature +# bit0 : 1= RZQ/6 supported +# bit1 : 1 = RZQ/7 supported +# bits[6:2]: reserved +# bit7 : 0 = DLL Off mode supported +03 + +# 31 SDRAM Thermal and Refresh Options +# bit0 : 0 = Temp up to 95c supported +# bit1 : 0 = 85-95c uses 2x refresh rate +# bit2 : 1 = Auto Self Refresh supported +# bit3 : 0 = no on die thermal sensor +# bits[6:4]: reserved +# bit7 : 0 = partial self refresh supported +04 + +# 32 Module Thermal Sensor +# 0 = Thermal sensor not incorporated onto this assembly +00 + +# 33 SDRAM Device Type +# bits[1:0]: 0 = Signal Loading not specified +# bits[3:2]: reserved +# bits[6:4]: 0 = Die count not specified +# bit7 : 0 = Standard Monolithic DRAM Device +00 + +# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) +# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) +# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) +# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) +# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) +00 00 00 00 00 + +# 39 - 59 (reserved) +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 + +# 60 Raw Card Extension, Module Nominal Height +# bits[4:0]: 0 = <= 15mm tall +# bits[7:5]: 0 = raw card revision 0-3 +00 + +# 61 Module Maximum Thickness +# bits[3:0]: 0 = thickness front <= 1mm +# bits[7:4]: 0 = thinkness back <= 1mm +00 + +# 62 Reference Raw Card Used +# bits[4:0]: 0 = Reference Raw card A used +# bits[6:5]: 0 = revision 0 +# bit7 : 0 = Reference raw cards A through AL +00 + +# 63 Address Mapping from Edge Connector to DRAM +# bit0 : 0 = standard mapping (not mirrored) +# bits[7:1]: reserved +00 + +# 64 - 116 (reserved) +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 +00 00 00 00 00 + +# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code +# 0x80AD = Hynix +80 AD + +# 119 Module ID: Module Manufacturing Location - oem specified +# 120 Module ID: Module Manufacture Year in BCD +# 0x00 = 2000 +00 00 + +# 121 Module ID: Module Manufacture week +# 0x00 = 0th week +00 + +# 122 - 125: Module Serial Number +00 00 00 00 + +# 126 - 127: Cyclical Redundancy Code +48 91 diff --git a/src/mainboard/bap/ode_e21XX/BiosCallOuts.c b/src/mainboard/bap/ode_e21XX/BiosCallOuts.c index 9528f72585..1b37865d17 100644 --- a/src/mainboard/bap/ode_e21XX/BiosCallOuts.c +++ b/src/mainboard/bap/ode_e21XX/BiosCallOuts.c @@ -25,15 +25,17 @@ #endif #include "hudson.h" #include <stdlib.h> +#include <spd_cache.h> static AGESA_STATUS Fch_Oem_config(UINT32 Func, UINT32 FchData, VOID *ConfigPtr); +static AGESA_STATUS board_ReadSpd_from_cbfs(UINT32 Func, UINTN Data, VOID *ConfigPtr); const BIOS_CALLOUT_STRUCT BiosCallouts[] = { {AGESA_ALLOCATE_BUFFER, agesa_AllocateBuffer }, {AGESA_DEALLOCATE_BUFFER, agesa_DeallocateBuffer }, {AGESA_LOCATE_BUFFER, agesa_LocateBuffer }, - {AGESA_READ_SPD, agesa_ReadSpd }, + {AGESA_READ_SPD, board_ReadSpd_from_cbfs }, {AGESA_DO_RESET, agesa_Reset }, {AGESA_READ_SPD_RECOVERY, agesa_NoopUnsupported }, {AGESA_RUNFUNC_ONAP, agesa_RunFuncOnAp }, @@ -303,3 +305,33 @@ static AGESA_STATUS Fch_Oem_config(UINT32 Func, UINT32 FchData, VOID *ConfigPtr) return AGESA_SUCCESS; } + +static AGESA_STATUS board_ReadSpd_from_cbfs(UINT32 Func, UINTN Data, VOID *ConfigPtr) +{ + AGESA_STATUS Status = AGESA_UNSUPPORTED; +#ifdef __PRE_RAM__ + AGESA_READ_SPD_PARAMS *info = ConfigPtr; + u8 index; + + if (IS_ENABLED(CONFIG_BAP_E21_DDR3_1066)) + index = 1; + else if (IS_ENABLED(CONFIG_BAP_E21_DDR3_1333)) + index = 2; + else /* CONFIG_BAP_E21_DDR3_800 */ + index = 0; + + if (info->MemChannelId > 0) + return AGESA_UNSUPPORTED; + if (info->SocketId != 0) + return AGESA_UNSUPPORTED; + if (info->DimmId != 0) + return AGESA_UNSUPPORTED; + + /* Read index 0, first SPD_SIZE bytes of spd.bin file. */ + if (read_spd_from_cbfs((u8 *)info->Buffer, index) < 0) + die("No SPD data\n"); + + Status = AGESA_SUCCESS; +#endif + return Status; +} diff --git a/src/mainboard/bap/ode_e21XX/Kconfig b/src/mainboard/bap/ode_e21XX/Kconfig index 426a99490d..b35674987c 100644 --- a/src/mainboard/bap/ode_e21XX/Kconfig +++ b/src/mainboard/bap/ode_e21XX/Kconfig @@ -26,6 +26,8 @@ config BOARD_SPECIFIC_OPTIONS # dummy select HAVE_ACPI_TABLES select BOARD_ROMSIZE_KB_8192 select GFXUMA + select SUPERIO_FINTEK_F81866D + select SPD_CACHE config MAINBOARD_DIR string @@ -51,4 +53,25 @@ config HUDSON_LEGACY_FREE bool default y +choice + prompt "Select DDR3 clock" + default BAP_E21_DDR3_1333 + help + Select your preferenced DDR3 clock setting. + + Note: This option changes the total power consumption. + + If unsure, use DDR3-1333. + +config BAP_E21_DDR3_800 + bool "Select DDR3-800" + +config BAP_E21_DDR3_1066 + bool "Select DDR3-1066" + +config BAP_E21_DDR3_1333 + bool "Select DDR3-1333" + +endchoice + endif # BOARD_ODE_E21XX diff --git a/src/mainboard/bap/ode_e21XX/Makefile.inc b/src/mainboard/bap/ode_e21XX/Makefile.inc index 37c1dceead..4f4a11d7ce 100644 --- a/src/mainboard/bap/ode_e21XX/Makefile.inc +++ b/src/mainboard/bap/ode_e21XX/Makefile.inc @@ -18,3 +18,23 @@ romstage-y += OemCustomize.c ramstage-y += BiosCallOuts.c ramstage-y += OemCustomize.c + +## DIMM SPD for on-board memory +SPD_BIN = $(obj)/spd.bin + +# Order of names in SPD_SOURCES is important! +SPD_SOURCES = BAP_Q7_800 BAP_Q7_1066 BAP_Q7_1333 + +SPD_DEPS := $(foreach f, $(SPD_SOURCES), src/mainboard/$(MAINBOARDDIR)/$(f).spd.hex) + +# Include spd rom data +$(SPD_BIN): $(SPD_DEPS) + for f in $+; \ + do for c in $$(cat $$f | grep -v ^#); \ + do printf $$(printf '\%o' 0x$$c); \ + done; \ + done > $@ + +cbfs-files-y += spd.bin +spd.bin-file := $(SPD_BIN) +spd.bin-type := spd diff --git a/src/mainboard/bap/ode_e21XX/OemCustomize.c b/src/mainboard/bap/ode_e21XX/OemCustomize.c index ac60c42082..3750ba4305 100644 --- a/src/mainboard/bap/ode_e21XX/OemCustomize.c +++ b/src/mainboard/bap/ode_e21XX/OemCustomize.c @@ -18,20 +18,10 @@ #define FILECODE PROC_GNB_PCIE_FAMILY_0X15_F15PCIECOMPLEXCONFIG_FILECODE static const PCIe_PORT_DESCRIPTOR PortList [] = { - /* Initialize Port descriptor (PCIe port, Lane 3, PCI Device 2, Function 5) */ + /* Initialize Port descriptor (PCIe port, Lanes 2-3, PCI Device 2, Function 4) */ { 0, - PCIE_ENGINE_DATA_INITIALIZER (PciePortEngine, 3, 3), - PCIE_PORT_DATA_INITIALIZER_V2 (PortEnabled, ChannelTypeExt6db, 2, 5, - HotplugDisabled, - PcieGenMaxSupported, - PcieGenMaxSupported, - AspmDisabled, 0x01, 0) - }, - /* Initialize Port descriptor (PCIe port, Lane 2, PCI Device 2, Function 4) */ - { - 0, - PCIE_ENGINE_DATA_INITIALIZER (PciePortEngine, 2, 2), + PCIE_ENGINE_DATA_INITIALIZER (PciePortEngine, 2, 3), PCIE_PORT_DATA_INITIALIZER_V2 (PortEnabled, ChannelTypeExt6db, 2, 4, HotplugDisabled, PcieGenMaxSupported, @@ -71,23 +61,17 @@ static const PCIe_PORT_DESCRIPTOR PortList [] = { }; static const PCIe_DDI_DESCRIPTOR DdiList [] = { - /* DP0 to HDMI0/DP */ + /* eDP0 to LVDS connector */ { 0, PCIE_ENGINE_DATA_INITIALIZER (PcieDdiEngine, 8, 11), PCIE_DDI_DATA_INITIALIZER (ConnectorTypeDP, Aux1, Hdp1) }, - /* DP1 to FCH */ - { - 0, - PCIE_ENGINE_DATA_INITIALIZER (PcieDdiEngine, 12, 15), - PCIE_DDI_DATA_INITIALIZER (ConnectorTypeDP, Aux2, Hdp2) - }, - /* DP2 to HDMI1/DP */ + /* DP1 to HDMI */ { DESCRIPTOR_TERMINATE_LIST, - PCIE_ENGINE_DATA_INITIALIZER (PcieDdiEngine, 16, 19), - PCIE_DDI_DATA_INITIALIZER (ConnectorTypeCrt, Aux3, Hdp3) + PCIE_ENGINE_DATA_INITIALIZER (PcieDdiEngine, 12, 15), + PCIE_DDI_DATA_INITIALIZER (ConnectorTypeHDMI, Aux2, Hdp2) }, }; diff --git a/src/mainboard/bap/ode_e21XX/acpi/superio.asl b/src/mainboard/bap/ode_e21XX/acpi/superio.asl new file mode 100644 index 0000000000..92bd10680b --- /dev/null +++ b/src/mainboard/bap/ode_e21XX/acpi/superio.asl @@ -0,0 +1,48 @@ +/* + * This file is part of the coreboot project. + * + * Copyright (C) 2013 Sage Electronic Engineering, LLC + * Copyright (C) 2015 BAP - Bruhnspace Advanced Projects + * (Written by Fabian Kunkel <fabi@adv.bruhnspace.com> for BAP) + * + * This program is free software; you can redistribute it and/or modify + * it under the terms of the GNU General Public License as published by + * the Free Software Foundation; version 2 of the License. + * + * This program is distributed in the hope that it will be useful, + * but WITHOUT ANY WARRANTY; without even the implied warranty of + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the + * GNU General Public License for more details. + */ + +/* SuperIO support for Windows */ + +Device (UAR1) { + Name (_HID, EISAID ("PNP0501")) + Name (_UID, 1) + Name (_CRS, ResourceTemplate () + { + IO (Decode16, 0x03F8, 0x03F8, 0x08, 0x08) + IRQNoFlags () {4} + }) + Name (_PRS, ResourceTemplate () + { + IO (Decode16, 0x03F8, 0x03F8, 0x08, 0x08) + IRQNoFlags () {4} + }) +} + +Device (UAR2) { + Name (_HID, EISAID ("PNP0501")) + Name (_UID, 2) + Name (_CRS, ResourceTemplate () + { + IO (Decode16, 0x02F8, 0x02F8, 0x08, 0x08) + IRQNoFlags () {3} + }) + Name (_PRS, ResourceTemplate () + { + IO (Decode16, 0x02F8, 0x02F8, 0x08, 0x08) + IRQNoFlags () {3} + }) +} diff --git a/src/mainboard/bap/ode_e21XX/board_info.txt b/src/mainboard/bap/ode_e21XX/board_info.txt index d2c6670225..dffb350694 100644 --- a/src/mainboard/bap/ode_e21XX/board_info.txt +++ b/src/mainboard/bap/ode_e21XX/board_info.txt @@ -1,5 +1,5 @@ -Board name: DB-FT3b (Olive Hill+) -Board URL: http://wwwd.amd.com/amd/devsite.nsf/platforms/DB-FT3.htm +Board name: ODE_e21xx +Board URL: http://www.unibap.com/advanced-heterogeneous-computing-modules/ Category: eval ROM protocol: SPI ROM socketed: n diff --git a/src/mainboard/bap/ode_e21XX/devicetree.cb b/src/mainboard/bap/ode_e21XX/devicetree.cb index ee0cd98bfe..1a900c0c7c 100644 --- a/src/mainboard/bap/ode_e21XX/devicetree.cb +++ b/src/mainboard/bap/ode_e21XX/devicetree.cb @@ -30,10 +30,9 @@ chip northbridge/amd/pi/00730F01/root_complex device pci 1.1 on end # Internal Multimedia device pci 2.0 on end # PCIe Host Bridge device pci 2.1 on end # x4 PCIe slot - device pci 2.2 on end # mPCIe slot - device pci 2.3 on end # Realtek NIC - device pci 2.4 on end # Edge Connector - device pci 2.5 on end # Edge Connector + device pci 2.2 on end # PCIe Q7 Realtek GBit LAN + device pci 2.3 on end # PCIe CB Realtek GBit LAN + device pci 2.4 on end # PCIe x2 BAP FPGA device pci 8.0 on end # Platform Security Processor end #chip northbridge/amd/pi/00730F01 @@ -42,18 +41,67 @@ chip northbridge/amd/pi/00730F01/root_complex device pci 11.0 on end # SATA device pci 12.0 on end # EHCI #0 device pci 13.0 on end # EHCI #1 - device pci 14.0 on # SMBus - chip drivers/generic/generic #dimm 0-0-0 - device i2c 50 on end - end - chip drivers/generic/generic #dimm 0-0-1 - device i2c 51 on end - end - end # SMbus + device pci 14.0 on end # SMBus device pci 14.2 on end # HDA 0x4383 - device pci 14.3 on end # LPC 0x439d + device pci 14.3 on # LPC 0x439d + chip superio/fintek/f81866d + register "hwm_amd_tsi_addr" = "0x98" # Set to AMD + register "hwm_amd_tsi_control" = "0x02" # Set to AMD + register "hwm_fan_select" = "0xC0" # Sets Fan2 to PWM + register "hwm_fan_mode" = "0xD5" # Sets FAN1-3 to Auto RPM mode + register "hwm_fan3_control" = "0x00" # Fan control 23kHz + register "hwm_fan2_temp_map_select" = "0x1E" # Fan control 23kHz + register "hwm_fan2_bound1" = "0x3C" # 60°C + register "hwm_fan2_bound2" = "0x32" # 50°C + register "hwm_fan2_bound3" = "0x28" # 40°C + register "hwm_fan2_bound4" = "0x1E" # 30°C + register "hwm_fan2_seg1_speed" = "0xFF" # 100% + register "hwm_fan2_seg2_speed" = "0xD9" # 85% + register "hwm_fan2_seg3_speed" = "0xB2" # 70% + register "hwm_fan2_seg4_speed" = "0x99" # 60% + register "hwm_fan2_seg5_speed" = "0x80" # 50% + register "hwm_temp_sens_type" = "0x04" # Sets temp sensor 1 type to to thermistor + device pnp 4e.0 off # Floppy + io 0x60 = 0x3f0 + irq 0x70 = 6 + drq 0x74 = 2 + end + device pnp 4e.3 off end # Parallel Port + device pnp 4e.4 on # Hardware Monitor + io 0x60 = 0x295 + irq 0x70 = 0 + end + device pnp 4e.5 off # Keyboard + io 0x60 = 0x60 + io 0x62 = 0x64 + irq 0x70 = 1 + end + device pnp 4e.6 off end # GPIO + device pnp 4e.7 on end # WDT + device pnp 4e.a off end # PME + device pnp 4e.10 on # COM1 + io 0x60 = 0x3f8 + irq 0x70 = 4 + end + device pnp 4e.11 on # COM2 + io 0x60 = 0x2f8 + irq 0x70 = 3 + end + device pnp 4e.12 off # COM3 + io 0x60 = 0x3e8 + irq 0x70 = 4 + end + device pnp 4e.13 off # COM4 + io 0x60 = 0x2e8 + irq 0x70 = 3 + end + device pnp 4e.14 off # COM5 + end + device pnp 4e.15 off # COM6 + end + end # f81866d + end #LPC device pci 14.7 on end # SD - device pci 16.0 on end # EHCI #2 end #chip southbridge/amd/pi/hudson device pci 18.0 on end @@ -62,10 +110,6 @@ chip northbridge/amd/pi/00730F01/root_complex device pci 18.3 on end device pci 18.4 on end device pci 18.5 on end - register "spdAddrLookup" = " - { - { {0xA0, 0xA2} }, // socket 0, channel 0, slots 0 & 1 - 8-bit SPD addresses - }" end #chip northbridge/amd/pi/00730F01 # CPU side of HT root complex end #domain diff --git a/src/mainboard/bap/ode_e21XX/dsdt.asl b/src/mainboard/bap/ode_e21XX/dsdt.asl index 45ae428d9f..3afae7a8a6 100644 --- a/src/mainboard/bap/ode_e21XX/dsdt.asl +++ b/src/mainboard/bap/ode_e21XX/dsdt.asl @@ -69,6 +69,8 @@ DefinitionBlock ( /* Describe PCI INT[A-H] for the Southbridge */ #include <southbridge/amd/pi/hudson/acpi/pci_int.asl> + /* Add UART support for Windows */ + #include "acpi/superio.asl" } /* End \_SB scope */ diff --git a/src/mainboard/bap/ode_e21XX/romstage.c b/src/mainboard/bap/ode_e21XX/romstage.c index a5c529e7c5..8466e251db 100644 --- a/src/mainboard/bap/ode_e21XX/romstage.c +++ b/src/mainboard/bap/ode_e21XX/romstage.c @@ -32,6 +32,10 @@ #include <cpu/x86/lapic.h> #include <southbridge/amd/pi/hudson/hudson.h> #include <cpu/amd/pi/s3_resume.h> +#include <superio/fintek/common/fintek.h> +#include <superio/fintek/f81866d/f81866d.h> + +#define SERIAL_DEV1 PNP_DEV(0x4e, F81866D_SP1) void cache_as_ram_main(unsigned long bist, unsigned long cpu_init_detectedx) { @@ -54,7 +58,7 @@ void cache_as_ram_main(unsigned long bist, unsigned long cpu_init_detectedx) if (!cpu_init_detectedx && boot_cpu()) { post_code(0x30); - + fintek_enable_serial(SERIAL_DEV1, CONFIG_TTYS0_BASE); post_code(0x31); console_init(); } @@ -68,16 +72,6 @@ void cache_as_ram_main(unsigned long bist, unsigned long cpu_init_detectedx) printk(BIOS_DEBUG, "BSP Family_Model: %08x \n", val); printk(BIOS_DEBUG, "cpu_init_detectedx = %08lx \n", cpu_init_detectedx); - /* - * This refers to LpcClkDrvSth settling time. Without this setting, processor - * initialization is slow or incorrect, so this wait has been replicated from - * earlier development boards. - */ - { - int i; - for(i = 0; i < 200000; i++) inb(0xCD6); - } - post_code(0x37); AGESAWRAPPER(amdinitreset); |