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authorNick Vaccaro <nvaccaro@google.com>2020-08-27 11:44:38 -0700
committerAaron Durbin <adurbin@chromium.org>2020-08-28 14:20:30 +0000
commit913ea9278f50b73427a50a54e91f8d5502d93219 (patch)
treee33acaae2444dcb9825306bb1c60a50e6c073e92 /src/mainboard/intel/kblrvp/ec.h
parent2afee1299176c643854941e49d74506e1d98fed3 (diff)
util/gen_spd: translate DeviceBusWidth to die bus width
If a memory part is a x16 part that has two dies and only a single rank, then the x16 describes the part width (since this solution will need to be a stacked solution) and as such, we must translate the DeviceBusWidth to the "die bus width" instead. Change DeviceBusWidth variable name to PackageBusWidth to be more descriptive BUG=b:166645306, b:160157545 TEST=run gen_spd and verify that spds for parts matching description above changed appropriately. Change-Id: Ia6f3ca109d344b7a015da28125a94ce10d2bdfb8 Signed-off-by: Nick Vaccaro <nvaccaro@google.com> Reviewed-on: https://review.coreboot.org/c/coreboot/+/44870 Tested-by: build bot (Jenkins) <no-reply@coreboot.org> Reviewed-by: Furquan Shaikh <furquan@google.com>
Diffstat (limited to 'src/mainboard/intel/kblrvp/ec.h')
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