diff options
author | Raul E Rangel <rrangel@chromium.org> | 2020-05-20 14:07:41 -0600 |
---|---|---|
committer | Martin Roth <martinroth@google.com> | 2020-05-27 23:18:12 +0000 |
commit | b3c41329fdca84a251c183bbc2b0767978e9d96f (patch) | |
tree | 47003eae89ad4f6dd86edb52b1fe203d7e7b14b5 /src/mainboard/google/zork/spd/hynix-HMAA1GS6CMR6N-VK.spd.hex | |
parent | fc9b8b916f7bc0c6ac1579b915937ed23ea3327a (diff) |
mb/google/zork: Add Picasso based Zork mainboard and variants
This is a copy of the mb/google/zork directory from the chromiumos
coreboot-zork branch. This was from commit 29308ac8606.
See https://chromium.googlesource.com/chromiumos/third_party/coreboot/+/29308ac8606/src/mainboard/google/zork
Changes:
* Minor changes to make the board build.
* Add bootblock.c.
* Modify romstage.c
* Removed the FSP_X configs from zork/Kconfig since they should be
set in picasso/Kconfig. picasso/Kconfig doesn't currently define the
binaries since they haven't been published. To get a working build
a custom config that sets FSP_X_FILE is required.
BUG=b:157140753
TEST=Build trembyle and boot to OS
Signed-off-by: Raul E Rangel <rrangel@chromium.org>
Change-Id: I3933fa54e3f603985a0818852a1c77d8e248484f
Reviewed-on: https://review.coreboot.org/c/coreboot/+/41581
Reviewed-by: Furquan Shaikh <furquan@google.com>
Reviewed-by: Martin Roth <martinroth@google.com>
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Diffstat (limited to 'src/mainboard/google/zork/spd/hynix-HMAA1GS6CMR6N-VK.spd.hex')
-rw-r--r-- | src/mainboard/google/zork/spd/hynix-HMAA1GS6CMR6N-VK.spd.hex | 331 |
1 files changed, 331 insertions, 0 deletions
diff --git a/src/mainboard/google/zork/spd/hynix-HMAA1GS6CMR6N-VK.spd.hex b/src/mainboard/google/zork/spd/hynix-HMAA1GS6CMR6N-VK.spd.hex new file mode 100644 index 0000000000..ff166d6e75 --- /dev/null +++ b/src/mainboard/google/zork/spd/hynix-HMAA1GS6CMR6N-VK.spd.hex @@ -0,0 +1,331 @@ +# Number of Serial PD Bytes Written / SPD Device Size (SPD Bytes Used : 384 / SPD Bytes Total : 512) +23 + +# SPD Revision (Rev. 1.1) +11 + +# Key Byte / DRAM Device Type (DDR4 SDRAM) +0C + +# Key Byte / Module Type (nECC SO-DIMM) +03 + +# SDRAM Density and Banks (2BG/4BK/8Gb) +45 + +# SDRAM Addressing (16/10) +21 + +# Primary SDRAM Package Type (DDP) +91 + +# SDRAM Optional Features (Unlimited MAC) +08 + +# SDRAM Thermal and Refresh Options (Reserved) +00 + +# Other SDRAM Optional Features (PPR) (hPPR, sPPR supported) +60 + +# Secondary SDRAM Package Type +00 + +# Module Nominal Volatage, VDD (1.2V) +03 + +# Module Organization (1Rx8) +01 + +# Module Memory Bus Width (LP/x64) +03 + +# Module Thermal Sensor (Termal sensor not incorporated) +00 + +# Extended Module Type (Reserved) +00 + +# Reserved +00 + +# Timebases (MTB : 125ps, FTB : 1ps) +00 + +# SDRAM Minimum Cycle Time (tCKAVGmin) (0.75ns) +06 + +# SDRAM Maximum Cycle Time (tCKAVGmax) (1.6ns) +0D + +# CAS Latencies Supported, First Byte (10, 11, 12, 13, 14) +F8 + +# CAS Latencies Supported, Second Byte (15, 16, 17, 18, 19, 20) +3F + +# CAS Latencies Supported, Third Byte +00 + +# CAS Latencies Supported, Fourth Byte +00 + +# Minimum CAS Latency Time (tAAmin) (13.75ns) +6E + +# Minimum RAS to CAS Delay Time (tRCDmin) (13.75ns) +6E + +# Minimum RAS to CAS Delay Time (tRPmin) (13.75ns) +6E + +# Upper Nibbles for tRASmin and tRCmin (32ns / 45.75ns) +11 + +# tRASmin, Least Significant Byte (32ns) +00 + +# tRCmin, Least Significant Byte (45.75ns) +6E + +# tRFC1min, LSB (350ns) +F0 + +# tRFC1min, MSB (350ns) +0A + +# tRFC2min, LSB (260ns) +20 + +# tRFC2min, MSB (260ns) +08 + +# tRFC4min, LSB (160ns) +00 + +# tRFC4min, MSB (160ns) +05 + +# Upper Nibble for tFAW (30ns) +00 + +# tFAWmin LSB (30ns) +F0 + +# tRRD_Smin (5.3ns) +2B + +# tRRD_L min (6.40ns) +34 + +# tCCD_Lmin, same bank group (5ns) +28 + +# tWRmin Upper Nibbles (15ns) +00 + +# tWRmin (15ns) +78 + +# tWTRmin Upper Nibbles (2.5ns/7.5ns) +00 + +# tWTR_Smin (2.5ns) +14 + +# tWTR_Lmin (7.5ns) +3C + +# Reserved +00 00 00 00 00 00 00 00 00 00 00 00 00 00 + +# Connector to SDRAM Bit Mapping (DQ0-3) +16 + +# Connector to SDRAM Bit Mapping (DQ4-7) +36 + +# Connector to SDRAM Bit Mapping (DQ8-11) +0B + +# Connector to SDRAM Bit Mapping (DQ12-15) +35 + +# Connector to SDRAM Bit Mapping (DQ16-19) +16 + +# Connector to SDRAM Bit Mapping (DQ20-23) +36 + +# Connector to SDRAM Bit Mapping (DQ24-27) +0B + +# Connector to SDRAM Bit Mapping (DQ28-31) +35 + +# Connector to SDRAM Bit Mapping (CB0-3) +00 + +# Connector to SDRAM Bit Mapping (CB4-7) +00 + +# Connector to SDRAM Bit Mapping (DQ32-35) +16 + +# Connector to SDRAM Bit Mapping (DQ36-39) +36 + +# Connector to SDRAM Bit Mapping (DQ40-43) +0B + +# Connector to SDRAM Bit Mapping (DQ44-47) +35 + +# Connector to SDRAM Bit Mapping (DQ48-51) +16 + +# Connector to SDRAM Bit Mapping (DQ52-55) +36 + +# Connector to SDRAM Bit Mapping (DQ56-59) +0B + +# Connector to SDRAM Bit Mapping (DQ60-63) +35 + +# Reserved +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 + +# Fine offset for tCCD_Lmin, same bank group (5ns) +00 + +# tRRD_L min offset (6.40ns) +9C + +# tRRD_Smin offset (5.3ns) +B5 + +# Fine offset for tRCmin (45.75ns) +00 + +# Fine offset for tRPmin (13.75ns) +00 + +# Fine offset for tRCDmin (13.75ns) +00 + +# Fine offset for tAAmin (13.75ns) +00 + +# Fine offset for tCKAVGmax (1.6ns) +E7 + +# Fine offset for tCKAVGmin (0.75ns) +00 + +# CRC for Base Configuration Section, LSB (CRC cover 0~125 byte) +FD + +# CRC for Base Configuration Section, MSB (CRC cover 0~125 byte) +EE + +# RC Extention, Module Nominal Height (30.00) +0F + +# Module Maximum Thickness (1.0/1.2) +01 + +# Reference Raw Card Used (ZZ0) +1F + +# Address Mapping from Edge Connector to DRAM (Standard) +00 + +# Reserved +00 00 00 00 00 00 00 00 + +# Reserved (Must be coded as 0x00) +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 + +# Reserved +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 + +# CRC for Module Specific Section, LSB (CRC cover 128~253 byte) +7D + +# CRC for Module Specific Section, MSB (CRC cover 128~253 byte) +21 + +# Reserved +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 + +# Module Manufacturer's ID Code, LSB (SK hynix) +80 + +# Module Manufacturer's ID Code, MSB (SK hynix) +AD + +# Module Manufacturing Location (SK hynix (Icheon)) +01 + +# Module Manufacturing Date (Variable) +00 + +# Module Manufacturing Date (Variable) +00 + +# Module Serial Number (Undefined) +00 + +# Module Serial Number (Undefined) +00 + +# Module Serial Number (Undefined) +00 + +# Module Serial Number (Undefined) +00 + +# Module Part Number (HMAA1GS6CMR6N-VK ) +48 4D 41 41 31 47 53 36 43 4D 52 36 4E 2D 56 4B +20 20 20 20 + +# Module Revision Code (Revision 0) +00 + +# DRAM Manufacturer's ID code, LSB (SK hynix) +80 + +# DRAM Manufacturer's ID code, MSB (SK hynix) +AD + +# DRAM Stepping (Undefined) +FF + +# Module Manufacturer's Specific Data +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 DD + +# Reserved +00 00 + +# End User Programmable +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 +00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |