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| author | Lean Sheng Tan <lean.sheng.tan@intel.com> | 2021-06-08 21:41:42 -0700 |
|---|---|---|
| committer | Werner Zeh <werner.zeh@siemens.com> | 2021-06-11 05:52:03 +0000 |
| commit | a96be277e1062796be7109a08a9ab9cdb6bf5d28 (patch) | |
| tree | 82f7e6433049613a67f6c831ae4044b5947b92e1 /src/arch/x86/mpspec.c | |
| parent | 08938a9be3fd5f02650926f87d00d0029fafc3c2 (diff) | |
soc/intel/elkhartlake: Update FSP-S PM & Thermal related configs
Further add initial Silicon UPD settings for thermal and power
management stuffs.
Signed-off-by: Lean Sheng Tan <lean.sheng.tan@intel.com>
Change-Id: I04ded059c36f18925b7a74c934fef2566c3db8fa
Reviewed-on: https://review.coreboot.org/c/coreboot/+/55335
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Werner Zeh <werner.zeh@siemens.com>
Diffstat (limited to 'src/arch/x86/mpspec.c')
0 files changed, 0 insertions, 0 deletions