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authorElyes HAOUAS <ehaouas@noos.fr>2019-10-08 16:30:43 +0200
committerNico Huber <nico.h@gmx.de>2019-10-09 10:40:56 +0000
commit86b683a888e46faea087e9fedae11792cb5d273a (patch)
tree741ebca537e3f92fb7d3b0ffe4beb269d4d23250 /src/arch/x86/mpspec.c
parent5d0942baa28141de0b4ad7dcd76cc3aba5964b1f (diff)
SMBIOS (Type 17): Add HBM device type and DIE form factor value
Add High Bandwidth Memory, High Bandwidth Memory Generation 2 and new form factor value (Die). Change-Id: Ia174e09bffdadeed4a18d443f75e2386d756e9bf Signed-off-by: Elyes HAOUAS <ehaouas@noos.fr> Reviewed-on: https://review.coreboot.org/c/coreboot/+/35893 Reviewed-by: Nico Huber <nico.h@gmx.de> Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
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