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| author | Elyes HAOUAS <ehaouas@noos.fr> | 2019-10-08 16:30:43 +0200 |
|---|---|---|
| committer | Nico Huber <nico.h@gmx.de> | 2019-10-09 10:40:56 +0000 |
| commit | 86b683a888e46faea087e9fedae11792cb5d273a (patch) | |
| tree | 741ebca537e3f92fb7d3b0ffe4beb269d4d23250 /src/arch/x86/mpspec.c | |
| parent | 5d0942baa28141de0b4ad7dcd76cc3aba5964b1f (diff) | |
SMBIOS (Type 17): Add HBM device type and DIE form factor value
Add High Bandwidth Memory, High Bandwidth Memory Generation 2 and new
form factor value (Die).
Change-Id: Ia174e09bffdadeed4a18d443f75e2386d756e9bf
Signed-off-by: Elyes HAOUAS <ehaouas@noos.fr>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/35893
Reviewed-by: Nico Huber <nico.h@gmx.de>
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Diffstat (limited to 'src/arch/x86/mpspec.c')
0 files changed, 0 insertions, 0 deletions