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authorJohn Su <john_su@compal.corp-partner.google.com>2020-11-18 13:47:43 +0800
committerKarthik Ramasubramanian <kramasub@google.com>2020-11-20 23:08:21 +0000
commite59f70a4d912c64c4b6fdd30c08fcea868da98bc (patch)
tree43d24640a0e347f97f471e64d6d736314bbc5731 /Makefile.inc
parent96a06dd46443754ab2aa07fd3ecacf03d34265e1 (diff)
mb/google/dedede/variants/madoo: Increase TCC offset from 5 to 10
Increase TCC offset value from 5 to 10 for Thermal Control Circuit (TCC) activation. BUG=b:171531244 TEST=build and verify by thermal team Signed-off-by: John Su <john_su@compal.corp-partner.google.com> Change-Id: Ic2822b059f166779e1f0bcf92e753dad1078783c Reviewed-on: https://review.coreboot.org/c/coreboot/+/47691 Reviewed-by: EricR Lai <ericr_lai@compal.corp-partner.google.com> Reviewed-by: Sumeet R Pawnikar <sumeet.r.pawnikar@intel.com> Reviewed-by: Karthik Ramasubramanian <kramasub@google.com> Reviewed-by: Ben Kao <ben.kao@intel.com> Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
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