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authorFrans Hendriks <fhendriks@eltan.com>2019-06-04 13:53:05 +0200
committerPhilipp Deppenwiese <zaolin.daisuki@gmail.com>2019-06-05 13:03:43 +0000
commit43b6e2ed7108859297512a6d4194335fb8237d1b (patch)
tree26163bc7aa32cb13bffabee2092f2f1550118dac /Documentation
parentd622507450464db5ee6cff7de03f9649a299018b (diff)
mainboard/facebook/fbg1701: Do initial mainboard commit
Initial support for Facebook FBG-1701 system. coreboot implementation based on Intel Strago mainboard. Configure 'Onboard memory manufacturer' which must match HW. BUG=N/A TEST=booting SeaBIOS and Linux 4.15+ kernel on Facebook FBG-1701 Change-Id: I28ac78a630ee705b1e546031f024bfe7f952ab39 Signed-off-by: Frans Hendriks <fhendriks@eltan.com> Reviewed-on: https://review.coreboot.org/c/coreboot/+/30414 Tested-by: build bot (Jenkins) <no-reply@coreboot.org> Reviewed-by: David Hendricks <david.hendricks@gmail.com> Reviewed-by: Patrick Rudolph <siro@das-labor.org>
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-rw-r--r--Documentation/mainboard/index.md4
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+# Facebook FBG-1701
+
+This page describes how to run coreboot on the Facebook FBG1701.
+
+FBG1701 are assembled with different onboard memory modules:
+ Rev 1.0 Onboard Samsung K4B8G1646D-MYKO memory
+ Rev 1.1 and 1.2 Onboard Micron MT41K512M16HA-125A memory
+
+Use make menuconfig to configure `onboard memory manufacturer` in Mainboard
+menu.
+
+## Required blobs
+
+This board currently requires:
+fsp blob 3rdparty/fsp/BraswellFspBinPkg/FspBin/BSWFSP.fd
+Microcode Intel Braswell cpuid 1046C4 version 410
+ (Used pre-build binary retrieved from Intel site)
+
+## Flashing coreboot
+
+### Internal programming
+
+The main SPI flash can be accessed using [flashrom].
+
+### External programming
+
+The system has an internal flash chip which is a 8 MiB soldered SOIC-8 chip.
+This chip is located to the top middle side of the board. It's located
+between SoC and Q7 connector. Use clip (or solder wires) to program
+the chip.
+Specifically, it's a Winbond W25Q64FW (1.8V), whose datasheet can be found
+[here][W25Q64FW].
+
+The system has an external flash chip which is a 8 MiB soldered SOIC-8 chip.
+This chip is located in the middle of carrier board close to the flex cable
+connection.
+Specifically, it's a Winbond W25Q64FV (3.3V), whose datasheet can be found
+[here][W25Q64FV].
+
+## Known issues
+
+- None
+
+## Untested
+
+- hardware monitor
+- SDIO
+- Full Embedded Controller support
+
+## Working
+
+- USB
+- Gigabit Ethernet
+- integrated graphics
+- flashrom
+- external graphics
+- PCIe
+- eMMC
+- SATA
+- serial port
+- SMBus
+- HDA
+- initialization with FSP MR2
+- SeaBIOS payload
+- Embedded Linux (Ubuntu 4.15+)
+
+## Technology
+
+```eval_rst
++------------------+--------------------------------------------------+
+| SoC | Intel Atom Processor N3710 |
++------------------+--------------------------------------------------+
+| CPU | Intel Braswell (N3710) |
++------------------+--------------------------------------------------+
+| Super I/O, EC | ITE8256 |
++------------------+--------------------------------------------------+
+| Coprocessor | Intel Management Engine |
++------------------+--------------------------------------------------+
+```
+
+[W25Q64FW]: https://www.winbond.com/resource-files/w25q64fw%20revn%2005182017%20sfdp.pdf
+[W25Q64FV]: https://www.winbond.com/resource-files/w25q64fv%20revs%2007182017.pdf
+[flashrom]: https://flashrom.org/Flashrom
diff --git a/Documentation/mainboard/index.md b/Documentation/mainboard/index.md
index fb4f5022aa..f63ef763fb 100644
--- a/Documentation/mainboard/index.md
+++ b/Documentation/mainboard/index.md
@@ -30,6 +30,10 @@ The boards in this section are not real mainboards, but emulators.
- [IceLake RVP](intel/icelake_rvp.md)
- [KBLRVP11](intel/kblrvp11.md)
+## Facebook
+
+- [FBG-1701](facebook/fbg1701.md)
+
## Foxconn
- [D41S](foxconn/d41s.md)