blob: c9138c05b372f214b59d08db08a8a6bf2f778c1d (
plain)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
|
#
# This file is part of the coreboot project.
#
# This program is free software; you can redistribute it and/or modify
# it under the terms of the GNU General Public License as published by
# the Free Software Foundation; version 2 of the License.
#
# This program is distributed in the hope that it will be useful,
# but WITHOUT ANY WARRANTY; without even the implied warranty of
# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
# GNU General Public License for more details.
# HYNIX-H5TQ2G83CFR
# SPD contents for APU 2GB DDR3 (1333MHz PC1333) soldered down
# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage
# bits[3:0]: 1 = 128 SPD Bytes Used
# bits[6:4]: 1 = 256 SPD Bytes Total
# bit7 : 0 = CRC covers bytes 0 ~ 125
11
# 1 SPD Revision -
# 0x10 = Revision 1.0
10
# 2 Key Byte / DRAM Device Type
# bits[7:0]: 0x0b = DDR3 SDRAM
0B
# 3 Key Byte / Module Type
# bits[3:0]: 3 = SO-DIMM
# bits[7:4]: reserved
03
# 4 SDRAM CHIP Density and Banks
# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip
# bits[6:4]: 0 = 3 (8 banks)
# bit7 : reserved
03
# 5 SDRAM Addressing
# bits[2:0]: 1 = 10 Column Address Bits
# bits[5:3]: 3 = 15 Row Address Bits
# bits[7:6]: reserved
19
# 6 Module Nominal Voltage, VDD
# bit0 : 0 = 1.5 V operable
# bit1 : 0 = NOT 1.35 V operable
# bit2 : 0 = NOT 1.25 V operable
# bits[7:3]: reserved
00
# 7 Module Organization
# bits[2:0]: 1 = 8 bits
# bits[5:3]: 0 = 1 Rank
# bits[7:6]: reserved
01
# 8 Module Memory Bus Width
# bits[2:0]: 3 = Primary bus width is 64 bits
# bits[4:3]: 0 = 0 bits (no bus width extension)
# bits[7:5]: reserved
03
# 9 Fine Timebase (FTB) Dividend / Divisor
# bits[3:0]: 0x01 divisor
# bits[7:4]: 0x01 dividend
# 1 / 1 = 1.0 ps
11
# 10 Medium Timebase (MTB) Dividend
# 11 Medium Timebase (MTB) Divisor
# 1 / 8 = .125 ns
01 08
# 12 SDRAM Minimum Cycle Time (tCKmin)
# 0x0c = tCKmin of 1.5 ns = in multiples of MTB
0C
# 13 Reserved
00
# 14 CAS Latencies Supported, Least Significant Byte
# 15 CAS Latencies Supported, Most Significant Byte
# Cas Latencies of 11 - 5 are supported
7E 00
# 16 Minimum CAS Latency Time (tAAmin)
# 0x6C = 13.5ns - DDR3-1333
6C
# 17 Minimum Write Recovery Time (tWRmin)
# 0x78 = tWR of 15ns - All DDR3 speed grades
78
# 18 Minimum RAS# to CAS# Delay Time (tRCDmin)
# 0x6E = 13.5ns - DDR3-1333
6C
# 19 Minimum Row Active to Row Active Delay Time (tRRDmin)
# 0x30 = 6ns
30
# 20 Minimum Row Precharge Delay Time (tRPmin)
# 0x6C = 13.5ns - DDR3-1333
6C
# 21 Upper Nibbles for tRAS and tRC
# bits[3:0]: tRAS most significant nibble = 1 (see byte 22)
# bits[7:4]: tRC most significant nibble = 1 (see byte 23)
11
# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB
# 0x120 = 36ns - DDR3-1333 (see byte 21)
20
# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB
# 0x28C = 49.5ns - DDR3-1333
8C
# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB
# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB
# 0x500 = 160ns - for 2 Gigabit chips
00 05
# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin)
# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins
3C
# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin)
# 0x3c = 7.5ns - All DDR3 SDRAM speed bins
3C
# 28 Upper Nibble for tFAWmin
# 29 Minimum Four Activate Window Delay Time (tFAWmin)
# 0x00F0 = 30ns - DDR3-1333, 1 KB page size
00 F0
# 30 SDRAM Optional Feature
# bit0 : 1= RZQ/6 supported
# bit1 : 1 = RZQ/7 supported
# bits[6:2]: reserved
# bit7 : 1 = DLL Off mode supported
83
# 31 SDRAM Thermal and Refresh Options
# bit0 : 1 = Temp up to 95c supported
# bit1 : 0 = 85-95c uses 2x refresh rate
# bit2 : 1 = Auto Self Refresh supported
# bit3 : 0 = no on die thermal sensor
# bits[6:4]: reserved
# bit7 : 0 = partial self refresh supported
05
# 32 Module Thermal Sensor
# 0 = Thermal sensor not incorporated onto this assembly
00
# 33 SDRAM Device Type
# bits[1:0]: 2 = Signal Loading
# bits[3:2]: reserved
# bits[6:4]: 4 = Die count
# bit7 : 0 = Standard Monolithic DRAM Device
42
# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin)
# 35 Fine Offset for Minimum CAS Latency Time (tAAmin)
# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin)
# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin)
# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin)
00 00 00 00 00
# 39 (reserved)
00
# 40 - 47 (reserved)
00 00 00 00 00 00 00 00
# 48 - 55 (reserved)
00 00 00 00 00 00 00 00
# 56 - 59 (reserved)
00 00 00 00
# 60 Raw Card Extension, Module Nominal Height
# bits[4:0]: 0 = <= 15mm tall
# bits[7:5]: 0 = raw card revision 0-3
00
# 61 Module Maximum Thickness
# bits[3:0]: 0 = thickness front <= 1mm
# bits[7:4]: 0 = thinkness back <= 1mm
00
# 62 Reference Raw Card Used
# bits[4:0]: 0 = Reference Raw card A used
# bits[6:5]: 0 = revision 0
# bit7 : 0 = Reference raw cards A through AL
00
# 63 Address Mapping from Edge Connector to DRAM
# bit0 : 0 = standard mapping (not mirrored)
# bits[7:1]: reserved
00
# 64 - 71 (reserved)
00 00 00 00 00 00 00 00
# 72 - 79 (reserved)
00 00 00 00 00 00 00 00
# 80 - 87 (reserved)
00 00 00 00 00 00 00 00
# 88 - 95 (reserved)
00 00 00 00 00 00 00 00
# 96 - 103 (reserved)
00 00 00 00 00 00 00 00
# 104 - 111 (reserved)
00 00 00 00 00 00 00 00
# 112 - 116 (reserved)
00 00 00 00 00
# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code
# 0x0001 = AMD
00 01
# 119 Module ID: Module Manufacturing Location - oem specified
00
# 120 Module ID: Module Manufacture Year in BCD
# 0x13 = 2013
# 121 Module ID: Module Manufacture week
# 0x12 = 12th week
13 12
# 122 - 125: Module Serial Number
00 00 00 00
# 126 - 127: Cyclical Redundancy Code
c4 1b
|
