# SPDX-License-Identifier: GPL-2.0-only # # 8 Gb DDR3 (1600 MHz 11-11-11) Micron MT41K512M16HA-125:A # # SINGLE DIE # # 512MBx16 64Mx16x8 ( 8 bank, 16 Rows, 10 Col, 2 KB page size ) # 5-6-7-8-9-10-11 # DDR3L-1600 # tCk 1.25ns # tRCD 13.75ns # tRP 13.75ns # tRAS 35ns # tRC 48.75ns # CL-tRCD-tRP 11-11-11 # 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage # bits[3:0]: 3 = 384 SPD Bytes Used # bits[6:4]: 1 = 256 SPD Bytes Total # bit7 : 0 = CRC covers bytes 0 ~ 128 23 # 1 SPD Revision # 0x10 = Revision 1.0 10 # 2 Key Byte / DRAM Device Type # bits[7:0]: 0x0c = DDR3 SDRAM 0B # 3 Key Byte / Module Type # bits[3:0]: 3 = SODIMM # bits[6:4]: 0 = Not hybrid # bits[7]: 0 = Not hybrid 03 # 4 SDRAM CHIP Density and Banks # bits[3:0]: 5 = 8 Gigabits Total SDRAM capacity per chip # bits[6:4]: 0 = 3 (8 banks) # bits[7]: reserved 05 # 5 SDRAM Addressing # bits[2:0]: 1 = 10 Column Address Bits # bits[5:3]: 4 = 16 Row Address Bits # bits[7:6]: 0 = reserved 21 # 6 Module Nominal Voltage # bits[0]: 0 = 1.5V operable # bits[1]: 1 = 1.35V operable # bits[2]: 0 = NOT 1.25V operable # bits[7:3]: reserved 02 # 7 Module Organization # bits[2:0]: 010b = 16 bits SDRAM device # bits[5:3]: 000b = 1 ranks # bits[7:6]: reserved 02 # 8 Module Memory Bus width # bits[2:0]: 3 = 64 bits pirmary bus width # bits[4:3]: 0 = 0 bits bus witdth extension # bits[7:5]: reserved 03 # 9 Fine Timebase (FTB) dividend / divisor # bits[3:0]: 1 = Divisor # bits[7:4]: 1 = Dividend 11 # 10 Medium Timebase (MTB) dividend # bits[7:0]: 0 = 1 (timebase 0.125ns) 01 # 11 Medium Timebase (MTB) divisor # bits[7:0]: 8 (timebase 0.125ns) 08 # 12 SDRAM Minimum cycle time (tCKmin) # 0xA tCK = 1.25ns (DDR3-1600 (800 MHz clock)) 0A # 13 Reserved 00 # 14 CAS Latencies supported, Least Significate Byte # Support 5,6,7,8,9,10,11 FE # 15 CAS Latencies supported, Most Significate Byte # No supporting CL 12-18 00 # 16 Minimum CAS Latency Time (tAAmin) # 0x69 tAA = 13.125ns (offset = 00) DDR3-1600K downbin 69 # 17 Minimum Write Recovery Time (tWRmin) # 0x78 tWR = 15 ns 78 # 18 Minimum RAS to CAS Delay Time (tRCDmin) # 0x69 tRCD = 13.125ns (offset 00) DDR3-1600K downbin 69 # 19 Minimum Row Active to Row Active Delay Time (tRRDmin) # 0x3C tRRD = 7.5ns DDR3-1600, 2KB 3C # 20 Minimum Row Precharge Delay Time (tRPmin) # 0x69 tRP = 13.125ns (offset 00) DDR3-1600K downbin 69 # 21 Upper Nibble for tRAS and tRC # 3:0 : 1 higher tRAS = 35ns # 7:0 : 1 higher tRC = 48.125ns 11 # 22 Minimum Active to Precharge Delay Time (tRASmin), Least Significant byte # lower 0x118 : tRAS = 35ns DDR3-1600 18 # 23 Minimum Active to Precharge Delay Time (tRCmin), Most Significant byte # lower 0x181 : tRC = 48.125ns (offset 00) DDR3-1600K downbin 81 # 24 Minimum Refresh Recovery Delay time (tRFCmin), Least Significant byte # lower 0xAF0 : tRFC = 350ns 8 Gb F0 # 25 Minimum Refresh Recovery Delay time (tRFCmin), Most Significant byte # higher 0xAF0 : tRFC = 350ns 8 Gb 0A # 26 tWTRmin # 0x3C : tWTR = 7.5 ns (DDR3) 3C # 27 tRTPmin # 0x3C : tRTP = 7.5 ns (DDR3) 3C # 28 Upper Nibble for tFAW # Bit [3:0] : 1 = higher 0x140 tFAW = 40ns 01 # 29 tFAWmin Lower # lower 0x140 : tFAW = 40ns 40 # 30 SDRAM Optional Features # byte [0] : 1 = RZQ/6 is support # byte [1] : 1 = RZQ/7 is supported # byte [7] : 1 = DLL-Off Mode support 83 # 31 Thermal options # byte [0] : 1 = 0 - 95C # byte [2] : 1 = Auto Self Refresh (ASR) is supported # byte [7] : 1 = Partial Array Self Refres (PASR) is supported 85 # 32 Module Thermal support # byte [0] : 0 = Thermal sensor accuracy undefined # byte [7] : 0 = No thermal sensor 00 # 33 SDRAM device type # byte [1:0] : 00b = Signal Loading not specified # byte [6:4] : 000b = Die count not specified # byte [7] : 1 = Non-Standard Device 80 # 34 Fine tCKmin # 0x00 tCK = 1.25ns (DDR3-1600 (800 MHz clock)) 00 # 35 Fine tAAmin # 0x00 tAA = 13.125ns (tAAmin offset = 00) DDR3-1600K downbin 00 # 36 Fine tRCDmin # 0x00 tRCD = 13.125ns DDR3-1600K downbin 00 # 37 Fine tRPmin # 0x00 tRP = 13.125ns (offset 00) DDR3-1600K downbin 00 # 38 Fine tRCmin # 0x00 tRC = 48.125ns (offset 00) DDR3-1600K downbin 00 # 39-59 reserved, general section 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 # 60-116 Module specific section 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 # 117-118 Module Manufacturer 80 2C # 119 Module Manufacturing Location 01 # 120-121 Module Manufacturing Date 13 0A # 122-125 Module Serial number 00 00 00 00 # 126-127 SPD CRC 00 00 # 128-145 Module Part number 4D 54 34 31 4B 35 31 32 4D 31 36 48 41 2D 31 32 35 00 # 145-146 Module revision code 00 00 # 148-149 DRAM Manufacturer ID code 80 2C # 150-175 Manufacturer Specific Data 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 # 176-255 Open for Customer Use # 176 - 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