From c5d3944ad5d6f7ad987fece6b8672394326f4678 Mon Sep 17 00:00:00 2001 From: Kamil Wcislo <kamil.wcislo@3mdeb.com> Date: Thu, 12 Oct 2017 11:11:07 +0200 Subject: mainboard/pcengines/apu2: use GENERIC_SPD_BIN MIME-Version: 1.0 Content-Type: text/plain; charset=UTF-8 Content-Transfer-Encoding: 8bit Use GENERIC_SPD_BIN method of adding the SPD bins to final rom. Change-Id: I242e393bafac41aa7743f83b52cadf027019ee6e Signed-off-by: Kamil Wcislo <kamil.wcislo@3mdeb.com> Reviewed-on: https://review.coreboot.org/21980 Tested-by: build bot (Jenkins) <no-reply@coreboot.org> Reviewed-by: Kyösti Mälkki <kyosti.malkki@gmail.com> --- src/mainboard/pcengines/apu2/HYNIX-2G-1333.spd.hex | 264 --------------------- .../pcengines/apu2/HYNIX-4G-1333-ECC.spd.hex | 261 -------------------- src/mainboard/pcengines/apu2/Kconfig | 1 + src/mainboard/pcengines/apu2/Makefile.inc | 20 +- .../pcengines/apu2/spd/HYNIX-2G-1333.spd.hex | 264 +++++++++++++++++++++ .../pcengines/apu2/spd/HYNIX-4G-1333-ECC.spd.hex | 261 ++++++++++++++++++++ 6 files changed, 528 insertions(+), 543 deletions(-) delete mode 100644 src/mainboard/pcengines/apu2/HYNIX-2G-1333.spd.hex delete mode 100644 src/mainboard/pcengines/apu2/HYNIX-4G-1333-ECC.spd.hex create mode 100644 src/mainboard/pcengines/apu2/spd/HYNIX-2G-1333.spd.hex create mode 100644 src/mainboard/pcengines/apu2/spd/HYNIX-4G-1333-ECC.spd.hex (limited to 'src') diff --git a/src/mainboard/pcengines/apu2/HYNIX-2G-1333.spd.hex b/src/mainboard/pcengines/apu2/HYNIX-2G-1333.spd.hex deleted file mode 100644 index a70db53eda..0000000000 --- a/src/mainboard/pcengines/apu2/HYNIX-2G-1333.spd.hex +++ /dev/null @@ -1,264 +0,0 @@ -# PCEngines 2Gb 1333 - -# SPD contents for APU 2GB DDR3 NO ECC (1333MHz PC1333) soldered down -# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage -# bits[3:0]: 1 = 128 SPD Bytes Used -# bits[6:4]: 1 = 256 SPD Bytes Total -# bit7 : 0 = CRC covers bytes 0 ~ 128 -01 - -# 1 SPD Revision -# 0x13 = Revision 1.3 -13 - -# 2 Key Byte / DRAM Device Type -# bits[7:0]: 0x0b = DDR3 SDRAM -0B - -# 3 Key Byte / Module Type -# bits[3:0]: 3 = SO-DIMM -# bits[3:0]: 8 = 72b-SO-DIMM -# bits[7:4]: reserved -03 - -# 4 SDRAM CHIP Density and Banks -# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip -# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip -# bits[6:4]: 0 = 3 (8 banks) -# bit7 : reserved -03 - -# 5 SDRAM Addressing -# bits[2:0]: 1 = 10 Column Address Bits -# bits[5:3]: 4 = 16 Row Address Bits -# bits[5:3]: 3 = 15 Row Address Bits -# bits[5:3]: 2 = 14 Row Address Bits -# bits[7:6]: reserved -19 - -# 6 Module Nominal Voltage, VDD -# bit0 : 0 = 1.5 V operable -# bit1 : 0 = NOT 1.35 V operable -# bit2 : 0 = NOT 1.25 V operable -# bits[7:3]: reserved -00 - -# 7 Module Organization -# bits[2:0]: 1 = 8 bits -# bits[2:0]: 2 = 16 bits -# bits[5:3]: 0 = 1 Rank -# bits[7:6]: reserved -01 - -# 8 Module Memory Bus Width -# bits[2:0]: 3 = Primary bus width is 64 bits -# bits[4:3]: 0 = 0 bits (no bus width extension) -# bits[4:3]: 1 = 8 bits (for ECC) -# bits[7:5]: reserved -03 - -# 9 Fine Timebase (FTB) Dividend / Divisor -# bits[3:0]: 0x02 divisor -# bits[7:4]: 0x05 dividend -# 5 / 2 = 2.5ps -52 - -# 10 Medium Timebase (MTB) Dividend -# 11 Medium Timebase (MTB) Divisor -# 1 / 8 = .125 ns -01 08 - -# 12 SDRAM Minimum Cycle Time (tCKmin) -# 0x0a = tCKmin of 1.25 ns = DDR3-1600 (800 MHz clock) -# 0x0c = tCKmin of 1.5 ns = DDR3-1333 (667 MHz clock) -# 0x0c = tCKmin of 1.5 ns = in multiples of MTB -0C - -# 13 Reserved -00 - -# 14 CAS Latencies Supported, Least Significant Byte -# 15 CAS Latencies Supported, Most Significant Byte -# Cas Latencies of 11 - 5 are supported -7E 00 - -# 16 Minimum CAS Latency Time (tAAmin) -# 0x6C = 13.5ns - DDR3-1333 -# 0x69 = 13.125 ns - DDR3-1333 -69 - -# 17 Minimum Write Recovery Time (tWRmin) -# 0x78 = tWR of 15ns - All DDR3 speed grades -78 - -# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) -# 0x6E = 13.5ns - DDR3-1333 -# 0x69 = 13.125 ns - DDR3-1333 -69 - -# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) -# 0x30 = 6.0ns -# 0x38 = 7.0ns -# 0x3C = 7.5ns -30 - -# 20 Minimum Row Precharge Delay Time (tRPmin) -# 0x6C = 13.5ns - -# 0x69 = 13.125 ns - DDR3-1333 -69 - -# 21 Upper Nibbles for tRAS and tRC -# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) -# bits[7:4]: tRC most significant nibble = 1 (see byte 23) -11 - -# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB -# 0x120 = 36ns - DDR3-1333 (see byte 21) -# 0x120 = 36ns - DDR3 -20 - -# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB -# 0x289 = 49.125ns - DDR3-1333 -89 - -# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB -# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB -# 0x500 = 160ns - for 2 Gigabit chips -# 0x820 = 260ns - for 4 Gigabit chips -00 05 - -# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) -# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins -3C - -# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) -# 0x3c = 7.5ns - All DDR3 SDRAM speed bins -3C - -# 28 Upper Nibble for tFAWmin -# 29 Minimum Four Activate Window Delay Time (tFAWmin) -# 0x00F0 = 30ns - DDR3-1333, 1 KB page size -00 F0 - -# 30 SDRAM Optional Feature -# bit0 : 1= RZQ/6 supported -# bit1 : 1 = RZQ/7 supported -# bits[6:2]: reserved -# bit7 : 1 = DLL Off mode supported -83 - -# 31 SDRAM Thermal and Refresh Options -# bit0 : 1 = Temp up to 95c supported -# bit1 : 0 = 85-95c uses 2x refresh rate -# bit2 : 1 = Auto Self Refresh supported -# bit3 : 0 = no on die thermal sensor -# bits[6:4]: reserved -# bit7 : 0 = partial self refresh supported -01 - -# 32 Module Thermal Sensor -# 0 = Thermal sensor not incorporated onto this assembly -00 - -# 33 SDRAM Device Type -# bits[1:0]: 0 = Signal Loading not specified -# bits[3:2]: reserved -# bits[6:4]: 0 = Die count not specified -# bit7 : 0 = Standard Monolithic DRAM Device -00 - -# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) -00 - -# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) -00 - -# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) -00 - -# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) -00 - -# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) -00 - -# 39 40 (reserved) -00 00 - -# 41 tMAW, MAC -# 8K*tREFI / 200k -86 - -# 42 - 47 (reserved) -00 00 00 00 00 00 - -# 48 - 55 (reserved) -00 00 00 00 00 00 00 00 - -# 56 - 59 (reserved) -00 00 00 00 - -# 60 Raw Card Extension, Module Nominal Height -# bits[4:0]: 0 = <= 15mm tall -# bits[7:5]: 0 = raw card revision 0-3 -00 - -# 61 Module Maximum Thickness -# bits[3:0]: 0 = thickness front <= 1mm -# bits[7:4]: 0 = thinkness back <= 1mm -00 - -# 62 Reference Raw Card Used -# bits[4:0]: 0 = Reference Raw card A used -# bits[6:5]: 0 = revision 0 -# bit7 : 0 = Reference raw cards A through AL -# revision B4 -61 - -# 63 Address Mapping from Edge Connector to DRAM -# bit0 : 0 = standard mapping (not mirrored) -# bits[7:1]: reserved -00 - -# 64 - 71 (reserved) -00 00 00 00 00 00 00 00 - -# 72 - 79 (reserved) -00 00 00 00 00 00 00 00 - -# 80 - 87 (reserved) -00 00 00 00 00 00 00 00 - -# 88 - 95 (reserved) -00 00 00 00 00 00 00 00 - -# 96 - 103 (reserved) -00 00 00 00 00 00 00 00 - -# 104 - 111 (reserved) -00 00 00 00 00 00 00 00 - -# 112 - 116 (reserved) -00 00 00 00 00 - -# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code -# 0x0001 = AMD -00 01 - -# 119 Module ID: Module Manufacturing Location - OEM specified -00 - -# 120 Module ID: Module Manufacture Year in BCD -# 0x15 = 2015 -15 - -# 121 Module ID: Module Manufacture week -# 0x44 = 44th week -44 - -# 122 - 125: Module Serial Number -00 00 00 00 - -# 126 - 127: Cyclical Redundancy Code -b6 73 - diff --git a/src/mainboard/pcengines/apu2/HYNIX-4G-1333-ECC.spd.hex b/src/mainboard/pcengines/apu2/HYNIX-4G-1333-ECC.spd.hex deleted file mode 100644 index ac6b4c6c9d..0000000000 --- a/src/mainboard/pcengines/apu2/HYNIX-4G-1333-ECC.spd.hex +++ /dev/null @@ -1,261 +0,0 @@ -# HYNIX-4GBYTE-1333 The H9 N0 SPD delivered by Hynix - -# SPD contents for APU 4GB DDR3 ECC (1333MHz PC1333) soldered down -# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage -# bits[3:0]: 1 = 128 SPD Bytes Used -# bits[6:4]: 1 = 256 SPD Bytes Total -# bit7 : 0 = CRC covers bytes 0 ~ 128 -01 - -# 1 SPD Revision - -# 0x13 = Revision 1.3 -13 -# 2 Key Byte / DRAM Device Type -# bits[7:0]: 0x0b = DDR3 SDRAM -0B - -# 3 Key Byte / Module Type -# bits[3:0]: 3 = SO-DIMM -# bits[3:0]: 8 = 72b-SO-DIMM -# bits[7:4]: reserved -08 - -# 4 SDRAM CHIP Density and Banks -# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip -# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip -# bits[6:4]: 0 = 3 (8 banks) -# bit7 : reserved -04 - -# 5 SDRAM Addressing -# bits[2:0]: 1 = 10 Column Address Bits -# bits[5:3]: 4 = 16 Row Address Bits -# bits[5:3]: 3 = 15 Row Address Bits -# bits[5:3]: 2 = 14 Row Address Bits -# bits[7:6]: reserved -21 - -# 6 Module Nominal Voltage, VDD -# bit0 : 0 = 1.5 V operable -# bit1 : 0 = NOT 1.35 V operable -# bit2 : 0 = NOT 1.25 V operable -# bits[7:3]: reserved -00 - -# 7 Module Organization -# bits[2:0]: 1 = 8 bits -# bits[2:0]: 2 = 16 bits -# bits[5:3]: 0 = 1 Rank -# bits[7:6]: reserved -01 - -# 8 Module Memory Bus Width -# bits[2:0]: 3 = Primary bus width is 64 bits -# bits[4:3]: 0 = 0 bits (no bus width extension) -# bits[4:3]: 1 = 8 bits (for ECC) -# bits[7:5]: reserved -0B - -# 9 Fine Timebase (FTB) Dividend / Divisor -# bits[3:0]: 0x02 divisor -# bits[7:4]: 0x05 dividend -# 5 / 2 = 2.5 ps -52 - -# 10 Medium Timebase (MTB) Dividend -# 11 Medium Timebase (MTB) Divisor -# 1 / 8 = .125 ns -01 08 - -# 12 SDRAM Minimum Cycle Time (tCKmin) -# 0x0a = tCKmin of 1.25 ns = DDR3-1600 (800 MHz clock) -# 0x0c = tCKmin of 1.5 ns = DDR3-1333 (667 MHz clock) -# 0x0c = tCKmin of 1.5 ns = in multiples of MTB -0C - -# 13 Reserved -00 - -# 14 CAS Latencies Supported, Least Significant Byte -# 15 CAS Latencies Supported, Most Significant Byte -# Cas Latencies of 11 - 5 are supported -7E 00 - -# 16 Minimum CAS Latency Time (tAAmin) -# 0x6C = 13.5ns - DDR3-1333 -# 0x69 = 13.125 ns - DDR3-1333 -69 - -# 17 Minimum Write Recovery Time (tWRmin) -# 0x78 = tWR of 15ns - All DDR3 speed grades -78 - -# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) -# 0x6E = 13.5ns - DDR3-1333 -# 0x69 = 13.125 ns - DDR3-1333 -69 - -# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) -# 0x30 = 6ns -# 0x38 = 7.0ns -# 0x3C = 7.5ns -30 - -# 20 Minimum Row Precharge Delay Time (tRPmin) -# 0x6C = 13.5ns - -# 0x69 = 13.125 ns - DDR3-1333 -69 - -# 21 Upper Nibbles for tRAS and tRC -# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) -# bits[7:4]: tRC most significant nibble = 1 (see byte 23) -11 - -# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB -# 0x120 = 36ns - DDR3-1333 (see byte 21) -# 0x120 = 36ns - DDR3 -20 - -# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB -# 0x28C = 49.5ns - DDR3-1333 -# 0x289 = 49.125ns - DDR3-1333 -89 - -# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB -# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB -# 0x500 = 160ns - for 2 Gigabit chips -# 0x820 = 260ns - for 4 Gigabit chips -20 08 - -# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) -# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins -3C - -# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) -# 0x3c = 7.5ns - All DDR3 SDRAM speed bins -3C - -# 28 Upper Nibble for tFAWmin -# 29 Minimum Four Activate Window Delay Time (tFAWmin) -# 0x00F0 = 30ns - DDR3-1333, 1 KB page size -00 F0 - -# 30 SDRAM Optional Feature -# bit0 : 1= RZQ/6 supported -# bit1 : 1 = RZQ/7 supported -# bits[6:2]: reserved -# bit7 : 1 = DLL Off mode supported -83 - -# 31 SDRAM Thermal and Refresh Options -# bit0 : 1 = Temp up to 95c supported -# bit1 : 0 = 85-95c uses 2x refresh rate -# bit2 : 1 = Auto Self Refresh supported -# bit3 : 0 = no on die thermal sensor -# bits[6:4]: reserved -# bit7 : 0 = partial self refresh supported -01 - -# 32 Module Thermal Sensor -# 0 = Thermal sensor not incorporated onto this assembly -00 - -# 33 SDRAM Device Type -# bits[1:0]: 0 = Signal Loading not specified -# bits[3:2]: reserved -# bits[6:4]: 0 = Die count not specified -# bit7 : 0 = Standard Monolithic DRAM Device -00 - -# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) -00 -# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) -00 -# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) -00 -# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) -00 -# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) -00 - -# 39 40 (reserved) -00 00 - -# 41 tMAW, MAC -# 8K*tREFI / 200k -86 - -# 42 - 47 (reserved) -00 00 00 00 00 00 - -# 48 - 55 (reserved) -00 00 00 00 00 00 00 00 - -# 56 - 59 (reserved) -00 00 00 00 - -# 60 Raw Card Extension, Module Nominal Height -# bits[4:0]: 0 = <= 15mm tall -# bits[7:5]: 0 = raw card revision 0-3 -00 - -# 61 Module Maximum Thickness -# bits[3:0]: 0 = thickness front <= 1mm -# bits[7:4]: 0 = thinkness back <= 1mm -00 - -# 62 Reference Raw Card Used -# bits[4:0]: 0 = Reference Raw card A used -# bits[6:5]: 0 = revision 0 -# bit7 : 0 = Reference raw cards A through AL -# revision B4 -61 - -# 63 Address Mapping from Edge Connector to DRAM -# bit0 : 0 = standard mapping (not mirrored) -# bits[7:1]: reserved -00 - -# 64 - 71 (reserved) -00 00 00 00 00 00 00 00 - -# 72 - 79 (reserved) -00 00 00 00 00 00 00 00 - -# 80 - 87 (reserved) -00 00 00 00 00 00 00 00 - -# 88 - 95 (reserved) -00 00 00 00 00 00 00 00 - -# 96 - 103 (reserved) -00 00 00 00 00 00 00 00 - -# 104 - 111 (reserved) -00 00 00 00 00 00 00 00 - -# 112 - 116 (reserved) -00 00 00 00 00 - -# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code -# 0x0001 = AMD -00 01 - -# 119 Module ID: Module Manufacturing Location - oem specified -00 - -# 120 Module ID: Module Manufacture Year in BCD -# 0x15 = 2015 -# 121 Module ID: Module Manufacture week -# 0x44 = 44th week -15 44 - -# 122 - 125: Module Serial Number -00 00 00 00 - -# 126 - 127: Cyclical Redundancy Code -67 94 - - - - diff --git a/src/mainboard/pcengines/apu2/Kconfig b/src/mainboard/pcengines/apu2/Kconfig index a077520aa1..cbcbb7cd63 100644 --- a/src/mainboard/pcengines/apu2/Kconfig +++ b/src/mainboard/pcengines/apu2/Kconfig @@ -29,6 +29,7 @@ config BOARD_SPECIFIC_OPTIONS # dummy select BOARD_ROMSIZE_KB_8192 select HUDSON_DISABLE_IMC select USE_BLOBS + select GENERIC_SPD_BIN select TPM select MAINBOARD_HAS_LPC_TPM diff --git a/src/mainboard/pcengines/apu2/Makefile.inc b/src/mainboard/pcengines/apu2/Makefile.inc index 77c6d789c3..3724b1748e 100644 --- a/src/mainboard/pcengines/apu2/Makefile.inc +++ b/src/mainboard/pcengines/apu2/Makefile.inc @@ -21,22 +21,6 @@ ramstage-y += BiosCallOuts.c ramstage-y += OemCustomize.c ramstage-y += gpio_ftns.c -## DIMM SPD for on-board memory -SPD_BIN = $(obj)/spd.bin - # Order of names in SPD_SOURCES is important! -SPD_SOURCES = HYNIX-2G-1333 HYNIX-4G-1333-ECC - -SPD_DEPS := $(foreach f, $(SPD_SOURCES), src/mainboard/$(MAINBOARDDIR)/$(f).spd.hex) - -# Include spd rom data -$(SPD_BIN): $(SPD_DEPS) - for f in $+; \ - do for c in $$(cat $$f | grep -v ^#); \ - do printf $$(printf '\%o' 0x$$c); \ - done; \ - done > $@ - -cbfs-files-y += spd.bin -spd.bin-file := $(SPD_BIN) -spd.bin-type := spd +SPD_SOURCES = HYNIX-2G-1333 +SPD_SOURCES += HYNIX-4G-1333-ECC diff --git a/src/mainboard/pcengines/apu2/spd/HYNIX-2G-1333.spd.hex b/src/mainboard/pcengines/apu2/spd/HYNIX-2G-1333.spd.hex new file mode 100644 index 0000000000..a70db53eda --- /dev/null +++ b/src/mainboard/pcengines/apu2/spd/HYNIX-2G-1333.spd.hex @@ -0,0 +1,264 @@ +# PCEngines 2Gb 1333 + +# SPD contents for APU 2GB DDR3 NO ECC (1333MHz PC1333) soldered down +# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage +# bits[3:0]: 1 = 128 SPD Bytes Used +# bits[6:4]: 1 = 256 SPD Bytes Total +# bit7 : 0 = CRC covers bytes 0 ~ 128 +01 + +# 1 SPD Revision +# 0x13 = Revision 1.3 +13 + +# 2 Key Byte / DRAM Device Type +# bits[7:0]: 0x0b = DDR3 SDRAM +0B + +# 3 Key Byte / Module Type +# bits[3:0]: 3 = SO-DIMM +# bits[3:0]: 8 = 72b-SO-DIMM +# bits[7:4]: reserved +03 + +# 4 SDRAM CHIP Density and Banks +# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip +# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip +# bits[6:4]: 0 = 3 (8 banks) +# bit7 : reserved +03 + +# 5 SDRAM Addressing +# bits[2:0]: 1 = 10 Column Address Bits +# bits[5:3]: 4 = 16 Row Address Bits +# bits[5:3]: 3 = 15 Row Address Bits +# bits[5:3]: 2 = 14 Row Address Bits +# bits[7:6]: reserved +19 + +# 6 Module Nominal Voltage, VDD +# bit0 : 0 = 1.5 V operable +# bit1 : 0 = NOT 1.35 V operable +# bit2 : 0 = NOT 1.25 V operable +# bits[7:3]: reserved +00 + +# 7 Module Organization +# bits[2:0]: 1 = 8 bits +# bits[2:0]: 2 = 16 bits +# bits[5:3]: 0 = 1 Rank +# bits[7:6]: reserved +01 + +# 8 Module Memory Bus Width +# bits[2:0]: 3 = Primary bus width is 64 bits +# bits[4:3]: 0 = 0 bits (no bus width extension) +# bits[4:3]: 1 = 8 bits (for ECC) +# bits[7:5]: reserved +03 + +# 9 Fine Timebase (FTB) Dividend / Divisor +# bits[3:0]: 0x02 divisor +# bits[7:4]: 0x05 dividend +# 5 / 2 = 2.5ps +52 + +# 10 Medium Timebase (MTB) Dividend +# 11 Medium Timebase (MTB) Divisor +# 1 / 8 = .125 ns +01 08 + +# 12 SDRAM Minimum Cycle Time (tCKmin) +# 0x0a = tCKmin of 1.25 ns = DDR3-1600 (800 MHz clock) +# 0x0c = tCKmin of 1.5 ns = DDR3-1333 (667 MHz clock) +# 0x0c = tCKmin of 1.5 ns = in multiples of MTB +0C + +# 13 Reserved +00 + +# 14 CAS Latencies Supported, Least Significant Byte +# 15 CAS Latencies Supported, Most Significant Byte +# Cas Latencies of 11 - 5 are supported +7E 00 + +# 16 Minimum CAS Latency Time (tAAmin) +# 0x6C = 13.5ns - DDR3-1333 +# 0x69 = 13.125 ns - DDR3-1333 +69 + +# 17 Minimum Write Recovery Time (tWRmin) +# 0x78 = tWR of 15ns - All DDR3 speed grades +78 + +# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) +# 0x6E = 13.5ns - DDR3-1333 +# 0x69 = 13.125 ns - DDR3-1333 +69 + +# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) +# 0x30 = 6.0ns +# 0x38 = 7.0ns +# 0x3C = 7.5ns +30 + +# 20 Minimum Row Precharge Delay Time (tRPmin) +# 0x6C = 13.5ns - +# 0x69 = 13.125 ns - DDR3-1333 +69 + +# 21 Upper Nibbles for tRAS and tRC +# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) +# bits[7:4]: tRC most significant nibble = 1 (see byte 23) +11 + +# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB +# 0x120 = 36ns - DDR3-1333 (see byte 21) +# 0x120 = 36ns - DDR3 +20 + +# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB +# 0x289 = 49.125ns - DDR3-1333 +89 + +# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB +# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB +# 0x500 = 160ns - for 2 Gigabit chips +# 0x820 = 260ns - for 4 Gigabit chips +00 05 + +# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) +# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins +3C + +# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) +# 0x3c = 7.5ns - All DDR3 SDRAM speed bins +3C + +# 28 Upper Nibble for tFAWmin +# 29 Minimum Four Activate Window Delay Time (tFAWmin) +# 0x00F0 = 30ns - DDR3-1333, 1 KB page size +00 F0 + +# 30 SDRAM Optional Feature +# bit0 : 1= RZQ/6 supported +# bit1 : 1 = RZQ/7 supported +# bits[6:2]: reserved +# bit7 : 1 = DLL Off mode supported +83 + +# 31 SDRAM Thermal and Refresh Options +# bit0 : 1 = Temp up to 95c supported +# bit1 : 0 = 85-95c uses 2x refresh rate +# bit2 : 1 = Auto Self Refresh supported +# bit3 : 0 = no on die thermal sensor +# bits[6:4]: reserved +# bit7 : 0 = partial self refresh supported +01 + +# 32 Module Thermal Sensor +# 0 = Thermal sensor not incorporated onto this assembly +00 + +# 33 SDRAM Device Type +# bits[1:0]: 0 = Signal Loading not specified +# bits[3:2]: reserved +# bits[6:4]: 0 = Die count not specified +# bit7 : 0 = Standard Monolithic DRAM Device +00 + +# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) +00 + +# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) +00 + +# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) +00 + +# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) +00 + +# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) +00 + +# 39 40 (reserved) +00 00 + +# 41 tMAW, MAC +# 8K*tREFI / 200k +86 + +# 42 - 47 (reserved) +00 00 00 00 00 00 + +# 48 - 55 (reserved) +00 00 00 00 00 00 00 00 + +# 56 - 59 (reserved) +00 00 00 00 + +# 60 Raw Card Extension, Module Nominal Height +# bits[4:0]: 0 = <= 15mm tall +# bits[7:5]: 0 = raw card revision 0-3 +00 + +# 61 Module Maximum Thickness +# bits[3:0]: 0 = thickness front <= 1mm +# bits[7:4]: 0 = thinkness back <= 1mm +00 + +# 62 Reference Raw Card Used +# bits[4:0]: 0 = Reference Raw card A used +# bits[6:5]: 0 = revision 0 +# bit7 : 0 = Reference raw cards A through AL +# revision B4 +61 + +# 63 Address Mapping from Edge Connector to DRAM +# bit0 : 0 = standard mapping (not mirrored) +# bits[7:1]: reserved +00 + +# 64 - 71 (reserved) +00 00 00 00 00 00 00 00 + +# 72 - 79 (reserved) +00 00 00 00 00 00 00 00 + +# 80 - 87 (reserved) +00 00 00 00 00 00 00 00 + +# 88 - 95 (reserved) +00 00 00 00 00 00 00 00 + +# 96 - 103 (reserved) +00 00 00 00 00 00 00 00 + +# 104 - 111 (reserved) +00 00 00 00 00 00 00 00 + +# 112 - 116 (reserved) +00 00 00 00 00 + +# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code +# 0x0001 = AMD +00 01 + +# 119 Module ID: Module Manufacturing Location - OEM specified +00 + +# 120 Module ID: Module Manufacture Year in BCD +# 0x15 = 2015 +15 + +# 121 Module ID: Module Manufacture week +# 0x44 = 44th week +44 + +# 122 - 125: Module Serial Number +00 00 00 00 + +# 126 - 127: Cyclical Redundancy Code +b6 73 + diff --git a/src/mainboard/pcengines/apu2/spd/HYNIX-4G-1333-ECC.spd.hex b/src/mainboard/pcengines/apu2/spd/HYNIX-4G-1333-ECC.spd.hex new file mode 100644 index 0000000000..ac6b4c6c9d --- /dev/null +++ b/src/mainboard/pcengines/apu2/spd/HYNIX-4G-1333-ECC.spd.hex @@ -0,0 +1,261 @@ +# HYNIX-4GBYTE-1333 The H9 N0 SPD delivered by Hynix + +# SPD contents for APU 4GB DDR3 ECC (1333MHz PC1333) soldered down +# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage +# bits[3:0]: 1 = 128 SPD Bytes Used +# bits[6:4]: 1 = 256 SPD Bytes Total +# bit7 : 0 = CRC covers bytes 0 ~ 128 +01 + +# 1 SPD Revision - +# 0x13 = Revision 1.3 +13 +# 2 Key Byte / DRAM Device Type +# bits[7:0]: 0x0b = DDR3 SDRAM +0B + +# 3 Key Byte / Module Type +# bits[3:0]: 3 = SO-DIMM +# bits[3:0]: 8 = 72b-SO-DIMM +# bits[7:4]: reserved +08 + +# 4 SDRAM CHIP Density and Banks +# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip +# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip +# bits[6:4]: 0 = 3 (8 banks) +# bit7 : reserved +04 + +# 5 SDRAM Addressing +# bits[2:0]: 1 = 10 Column Address Bits +# bits[5:3]: 4 = 16 Row Address Bits +# bits[5:3]: 3 = 15 Row Address Bits +# bits[5:3]: 2 = 14 Row Address Bits +# bits[7:6]: reserved +21 + +# 6 Module Nominal Voltage, VDD +# bit0 : 0 = 1.5 V operable +# bit1 : 0 = NOT 1.35 V operable +# bit2 : 0 = NOT 1.25 V operable +# bits[7:3]: reserved +00 + +# 7 Module Organization +# bits[2:0]: 1 = 8 bits +# bits[2:0]: 2 = 16 bits +# bits[5:3]: 0 = 1 Rank +# bits[7:6]: reserved +01 + +# 8 Module Memory Bus Width +# bits[2:0]: 3 = Primary bus width is 64 bits +# bits[4:3]: 0 = 0 bits (no bus width extension) +# bits[4:3]: 1 = 8 bits (for ECC) +# bits[7:5]: reserved +0B + +# 9 Fine Timebase (FTB) Dividend / Divisor +# bits[3:0]: 0x02 divisor +# bits[7:4]: 0x05 dividend +# 5 / 2 = 2.5 ps +52 + +# 10 Medium Timebase (MTB) Dividend +# 11 Medium Timebase (MTB) Divisor +# 1 / 8 = .125 ns +01 08 + +# 12 SDRAM Minimum Cycle Time (tCKmin) +# 0x0a = tCKmin of 1.25 ns = DDR3-1600 (800 MHz clock) +# 0x0c = tCKmin of 1.5 ns = DDR3-1333 (667 MHz clock) +# 0x0c = tCKmin of 1.5 ns = in multiples of MTB +0C + +# 13 Reserved +00 + +# 14 CAS Latencies Supported, Least Significant Byte +# 15 CAS Latencies Supported, Most Significant Byte +# Cas Latencies of 11 - 5 are supported +7E 00 + +# 16 Minimum CAS Latency Time (tAAmin) +# 0x6C = 13.5ns - DDR3-1333 +# 0x69 = 13.125 ns - DDR3-1333 +69 + +# 17 Minimum Write Recovery Time (tWRmin) +# 0x78 = tWR of 15ns - All DDR3 speed grades +78 + +# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) +# 0x6E = 13.5ns - DDR3-1333 +# 0x69 = 13.125 ns - DDR3-1333 +69 + +# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) +# 0x30 = 6ns +# 0x38 = 7.0ns +# 0x3C = 7.5ns +30 + +# 20 Minimum Row Precharge Delay Time (tRPmin) +# 0x6C = 13.5ns - +# 0x69 = 13.125 ns - DDR3-1333 +69 + +# 21 Upper Nibbles for tRAS and tRC +# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) +# bits[7:4]: tRC most significant nibble = 1 (see byte 23) +11 + +# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB +# 0x120 = 36ns - DDR3-1333 (see byte 21) +# 0x120 = 36ns - DDR3 +20 + +# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB +# 0x28C = 49.5ns - DDR3-1333 +# 0x289 = 49.125ns - DDR3-1333 +89 + +# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB +# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB +# 0x500 = 160ns - for 2 Gigabit chips +# 0x820 = 260ns - for 4 Gigabit chips +20 08 + +# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) +# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins +3C + +# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) +# 0x3c = 7.5ns - All DDR3 SDRAM speed bins +3C + +# 28 Upper Nibble for tFAWmin +# 29 Minimum Four Activate Window Delay Time (tFAWmin) +# 0x00F0 = 30ns - DDR3-1333, 1 KB page size +00 F0 + +# 30 SDRAM Optional Feature +# bit0 : 1= RZQ/6 supported +# bit1 : 1 = RZQ/7 supported +# bits[6:2]: reserved +# bit7 : 1 = DLL Off mode supported +83 + +# 31 SDRAM Thermal and Refresh Options +# bit0 : 1 = Temp up to 95c supported +# bit1 : 0 = 85-95c uses 2x refresh rate +# bit2 : 1 = Auto Self Refresh supported +# bit3 : 0 = no on die thermal sensor +# bits[6:4]: reserved +# bit7 : 0 = partial self refresh supported +01 + +# 32 Module Thermal Sensor +# 0 = Thermal sensor not incorporated onto this assembly +00 + +# 33 SDRAM Device Type +# bits[1:0]: 0 = Signal Loading not specified +# bits[3:2]: reserved +# bits[6:4]: 0 = Die count not specified +# bit7 : 0 = Standard Monolithic DRAM Device +00 + +# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) +00 +# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) +00 +# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) +00 +# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) +00 +# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) +00 + +# 39 40 (reserved) +00 00 + +# 41 tMAW, MAC +# 8K*tREFI / 200k +86 + +# 42 - 47 (reserved) +00 00 00 00 00 00 + +# 48 - 55 (reserved) +00 00 00 00 00 00 00 00 + +# 56 - 59 (reserved) +00 00 00 00 + +# 60 Raw Card Extension, Module Nominal Height +# bits[4:0]: 0 = <= 15mm tall +# bits[7:5]: 0 = raw card revision 0-3 +00 + +# 61 Module Maximum Thickness +# bits[3:0]: 0 = thickness front <= 1mm +# bits[7:4]: 0 = thinkness back <= 1mm +00 + +# 62 Reference Raw Card Used +# bits[4:0]: 0 = Reference Raw card A used +# bits[6:5]: 0 = revision 0 +# bit7 : 0 = Reference raw cards A through AL +# revision B4 +61 + +# 63 Address Mapping from Edge Connector to DRAM +# bit0 : 0 = standard mapping (not mirrored) +# bits[7:1]: reserved +00 + +# 64 - 71 (reserved) +00 00 00 00 00 00 00 00 + +# 72 - 79 (reserved) +00 00 00 00 00 00 00 00 + +# 80 - 87 (reserved) +00 00 00 00 00 00 00 00 + +# 88 - 95 (reserved) +00 00 00 00 00 00 00 00 + +# 96 - 103 (reserved) +00 00 00 00 00 00 00 00 + +# 104 - 111 (reserved) +00 00 00 00 00 00 00 00 + +# 112 - 116 (reserved) +00 00 00 00 00 + +# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code +# 0x0001 = AMD +00 01 + +# 119 Module ID: Module Manufacturing Location - oem specified +00 + +# 120 Module ID: Module Manufacture Year in BCD +# 0x15 = 2015 +# 121 Module ID: Module Manufacture week +# 0x44 = 44th week +15 44 + +# 122 - 125: Module Serial Number +00 00 00 00 + +# 126 - 127: Cyclical Redundancy Code +67 94 + + + + -- cgit v1.2.3